Wireless power transfer with in-line sensing and control based on detection of chargeable device

ABSTRACT

A device operative to transfer power wirelessly includes a drive-sense circuit (DSC), memory that stores operational instructions, and processing module(s). The DSC generates a drive signal based on a reference signal and provides the drive signal to a first coil via a single line and via a resonating capacitor, and simultaneously senses the drive signal via the single line, to facilitate electromagnetic coupling to a second coil to transfer power wirelessly to another device. The DSC also detects electrical characteristic(s) of the drive signal. The processing module(s) generates the reference signal and processes the digital signal to determine the electrical characteristic(s) of the drive signal. In some examples, the processing module(s) adapts the reference signal based on detection of the other device (e.g., based on interpreting the electrical characteristic(s) of the drive signal).

CROSS REFERENCE TO RELATED PATENTS

The present U.S. Utility Patent Application claims priority pursuant to35 U. S.C. § 120 as a continuation of U.S. Utility application Ser. No.16/428,131, entitled “Wireless Power Transfer with In-line Sensing andControl,” filed May 31, 2019, pending, which is hereby incorporatedherein by reference in its entirety and made part of the present U.S.Utility Patent Application for all purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

BACKGROUND OF THE INVENTION Technical Field of the Invention

This invention relates generally to wireless power transfer and datacommunication systems and more particularly to wireless power transfer,sensed data collection, and/or communication.

Description of Related Art

Sensors are used in a wide variety of applications ranging from in-homeautomation, to industrial systems, to health care, to transportation,and so on. For example, sensors are placed in bodies, automobiles,airplanes, boats, ships, trucks, motorcycles, cell phones, televisions,touch-screens, industrial plants, appliances, motors, checkout counters,etc. for the variety of applications.

In general, a sensor converts a physical quantity into an electrical oroptical signal. For example, a sensor converts a physical phenomenon,such as a biological condition, a chemical condition, an electriccondition, an electromagnetic condition, a temperature, a magneticcondition, mechanical motion (position, velocity, acceleration, force,pressure), an optical condition, and/or a radioactivity condition, intoan electrical signal.

A sensor includes a transducer, which functions to convert one form ofenergy (e.g., force) into another form of energy (e.g., electricalsignal). There are a variety of transducers to support the variousapplications of sensors. For example, a transducer is capacitor, apiezoelectric transducer, a piezoresistive transducer, a thermaltransducer, a thermal-couple, a photoconductive transducer such as aphotoresistor, a photodiode, and/or phototransistor.

A sensor circuit is coupled to a sensor to provide the sensor with powerand to receive the signal representing the physical phenomenon from thesensor. The sensor circuit includes at least three electricalconnections to the sensor: one for a power supply; another for a commonvoltage reference (e.g., ground); and a third for receiving the signalrepresenting the physical phenomenon. The signal representing thephysical phenomenon will vary from the power supply voltage to ground asthe physical phenomenon changes from one extreme to another (for therange of sensing the physical phenomenon).

The sensor circuits provide the received sensor signals to one or morecomputing devices for processing. A computing device is known tocommunicate data, process data, and/or store data. The computing devicemay be a cellular phone, a laptop, a tablet, a personal computer (PC), awork station, a video game device, a server, and/or a data center thatsupport millions of web searches, stock trades, or on-line purchasesevery hour.

The computing device processes the sensor signals for a variety ofapplications. For example, the computing device processes sensor signalsto determine temperatures of a variety of items in a refrigerated truckduring transit. As another example, the computing device processes thesensor signals to determine a touch on a touch screen. As yet anotherexample, the computing device processes the sensor signals to determinevarious data points in a production line of a product.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice in accordance with the present invention;

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 5A is a schematic plot diagram of a computing subsystem inaccordance with the present invention;

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 6 is a schematic block diagram of a drive center circuit inaccordance with the present invention;

FIG. 6A is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present invention;

FIG. 7 is an example of a power signal graph in accordance with thepresent invention;

FIG. 8 is an example of a sensor graph in accordance with the presentinvention;

FIG. 9 is a schematic block diagram of another example of a power signalgraph in accordance with the present invention;

FIG. 10 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11A is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit in accordance with the present invention;

FIG. 13 is a schematic block diagram of another embodiment of adrive-sense circuit in accordance with the present invention;

FIG. 14 is a schematic block diagram of an embodiment of various devicesincluding a device that is operative to transfer power wirelessly inaccordance with the present invention;

FIG. 15 is a schematic block diagram of an embodiment of various devicesincluding a device that is operative to transfer power and communicatewirelessly in accordance with the present invention;

FIG. 16 is a schematic block diagram of an embodiment of various devicesincluding a prior art device that is operative to transfer powerwirelessly in accordance with the present invention;

FIG. 17 is a schematic block diagram of an embodiment of various devicesincluding a device that is operative to transfer power wirelessly and/ortransfer power and communicate wirelessly in accordance with the presentinvention;

FIG. 18 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer powerwirelessly and/or transfer power and communicate wirelessly inaccordance with the present invention;

FIG. 19 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer powerwirelessly and/or transfer power and communicate wirelessly inaccordance with the present invention;

FIG. 20 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer power andcommunicate wirelessly in accordance with the present invention;

FIG. 21 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer power andcommunicate wirelessly in accordance with the present invention;

FIG. 22 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer power andcommunicate wirelessly in accordance with the present invention;

FIG. 23 is a schematic block diagram of an embodiment of a batteryimpedance profile such as associated with a battery of a device duringbattery charging in accordance with wireless transfer of power inaccordance with the present invention;

FIG. 24 is a schematic block diagram of an embodiment of a batterytemperature profile such as associated with a battery of a device duringbattery charging in accordance with wireless transfer of power inaccordance with the present invention; and

FIG. 25 is a schematic block diagram of another embodiment of variousdevices including a device that is operative to transfer power andcommunicate wirelessly in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem 10 that includes a plurality of computing. devices 12-10, one ormore servers 22, one or more databases 24, one or more networks 26, aplurality of drive-sense circuits 28, a plurality of sensors 30, and aplurality of actuators 32. Computing devices 14 include a touch screen16 with sensors and drive-sensor circuits and computing devices 18include a touch & tactic screen 20 that includes sensors, actuators, anddrive-sense circuits.

A sensor 30 functions to convert a physical input into an electricaloutput and/or an optical output. The physical input of a sensor may beone of a variety of physical input conditions. For example, the physicalcondition includes one or more of, but is not limited to, acoustic waves(e.g., amplitude, phase, polarization, spectrum, and/or wave velocity);a biological and/or chemical condition (e.g., fluid concentration,level, composition, etc.); an electric condition (e.g., charge, voltage,current, conductivity, permittivity, eclectic field, which includesamplitude, phase, and/or polarization); a magnetic condition (e.g.,flux, permeability, magnetic field, which amplitude, phase, and/orpolarization); an optical condition (e.g., refractive index,reflectivity, absorption, etc.); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). For example, piezoelectric sensorconverts force or pressure into an eclectic signal. As another example,a microphone converts audible acoustic waves into electrical signals.

There are a variety of types of sensors to sense the various types ofphysical conditions. Sensor types include, but are not limited to,capacitor sensors, inductive sensors, accelerometers, piezoelectricsensors, light sensors, magnetic field sensors, ultrasonic sensors,temperature sensors, infrared (IR) sensors, touch sensors, proximitysensors, pressure sensors, level sensors, smoke sensors, and gassensors. In many ways, sensors function as the interface between thephysical world and the digital world by converting real world conditionsinto digital signals that are then processed by computing devices for avast number of applications including, but not limited to, medicalapplications, production automation applications, home environmentcontrol, public safety, and so on.

The various types of sensors have a variety of sensor characteristicsthat are factors in providing power to the sensors, receiving signalsfrom the sensors, and/or interpreting the signals from the sensors. Thesensor characteristics include resistance, reactance, powerrequirements, sensitivity, range, stability, repeatability, linearity,error, response time, and/or frequency response. For example, theresistance, reactance, and/or power requirements are factors indetermining drive circuit requirements. As another example, sensitivity,stability, and/or linear are factors for interpreting the measure of thephysical condition based on the received electrical and/or opticalsignal (e.g., measure of temperature, pressure, etc.).

An actuator 32 converts an electrical input into a physical output. Thephysical output of an actuator may be one of a variety of physicaloutput conditions. For example, the physical output condition includesone or more of, but is not limited to, acoustic waves (e.g., amplitude,phase, polarization, spectrum, and/or wave velocity); a magneticcondition (e.g., flux, permeability, magnetic field, which amplitude,phase, and/or polarization); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). As an example, a piezoelectric actuatorconverts voltage into force or pressure. As another example, a speakerconverts electrical signals into audible acoustic waves.

An actuator 32 may be one of a variety of actuators. For example, anactuator 32 is one of a comb drive, a digital micro-mirror device, anelectric motor, an electroactive polymer, a hydraulic cylinder, apiezoelectric actuator, a pneumatic actuator, a screw jack, aservomechanism, a solenoid, a stepper motor, a shape-memory allow, athermal bimorph, and a hydraulic actuator.

The various types of actuators have a variety of actuatorscharacteristics that are factors in providing power to the actuator andsending signals to the actuators for desired performance. The actuatorcharacteristics include resistance, reactance, power requirements,sensitivity, range, stability, repeatability, linearity, error, responsetime, and/or frequency response. For example, the resistance, reactance,and power requirements are factors in determining drive circuitrequirements. As another example, sensitivity, stability, and/or linearare factors for generating the signaling to send to the actuator toobtain the desired physical output condition.

The computing devices 12, 14, and 18 may each be a portable computingdevice and/or a fixed computing device. A portable computing device maybe a social networking device, a gaming device, a cell phone, a smartphone, a digital assistant, a digital music player, a digital videoplayer, a laptop computer, a handheld computer, a tablet, a video gamecontroller, and/or any other portable device that includes a computingcore. A fixed computing device may be a computer (PC), a computerserver, a cable set-top box, a satellite receiver, a television set, aprinter, a fax machine, home entertainment equipment, a video gameconsole, and/or any type of home or office computing equipment. Thecomputing devices 12, 14, and 18 will be discussed in greater detailwith reference to one or more of FIGS. 2-4.

A server 22 is a special type of computing device that is optimized forprocessing large amounts of data requests in parallel. A server 22includes similar components to that of the computing devices 12, 14,and/or 18 with more robust processing modules, more main memory, and/ormore hard drive memory (e.g., solid state, hard drives, etc.). Further,a server 22 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a server may be a standalone separate computing device and/ormay be a cloud computing device.

A database 24 is a special type of computing device that is optimizedfor large scale data storage and retrieval. A database 24 includessimilar components to that of the computing devices 12, 14, and/or 18with more hard drive memory (e.g., solid state, hard drives, etc.) andpotentially with more processing modules and/or main memory. Further, adatabase 24 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a database 24 may be a standalone separate computing deviceand/or may be a cloud computing device.

The network 26 includes one more local area networks (LAN) and/or one ormore wide area networks WAN), which may be a public network and/or aprivate network. A LAN may be a wireless-LAN (e.g., Wi-Fi access point,Bluetooth, ZigBee, etc.) and/or a wired network (e.g., Firewire,Ethernet, etc.). A WAN may be a wired and/or wireless WAN. For example,a LAN may be a personal home or business's wireless network and a WAN isthe Internet, cellular telephone infrastructure, and/or satellitecommunication infrastructure.

In an example of operation, computing device 12-1 communicates with aplurality of drive-sense circuits 28, which, in turn, communicate with aplurality of sensors 30. The sensors 30 and/or the drive-sense circuits28 are within the computing device 12-1 and/or external to it. Forexample, the sensors 30 may be external to the computing device 12-1 andthe drive-sense circuits are within the computing device 12-1. Asanother example, both the sensors 30 and the drive-sense circuits 28 areexternal to the computing device 12-1. When the drive-sense circuits 28are external to the computing device, they are coupled to the computingdevice 12-1 via wired and/or wireless communication links as will bediscussed in greater detail with reference to one or more of FIGS.5A-5C.

The computing device 12-1 communicates with the drive-sense circuits 28to; (a) turn them on, (b) obtain data from the sensors (individuallyand/or collectively), (c) instruct the drive sense circuit on how tocommunicate the sensed data to the computing device 12-1, (d) providesignaling attributes (e.g., DC level, AC level, frequency, power level,regulated current signal, regulated voltage signal, regulation of animpedance, frequency patterns for various sensors, different frequenciesfor different sensing applications, etc.) to use with the sensors,and/or (e) provide other commands and/or instructions.

As a specific example, the sensors 30 are distributed along a pipelineto measure flow rate and/or pressure within a section of the pipeline.The drive-sense circuits 28 have their own power source (e.g., battery,power supply, etc.) and are proximally located to their respectivesensors 30. At desired time intervals (milliseconds, seconds, minutes,hours, etc.), the drive-sense circuits 28 provide a regulated sourcesignal or a power signal to the sensors 30. An electrical characteristicof the sensor 30 affects the regulated source signal or power signal,which is reflective of the condition (e.g., the flow rate and/or thepressure) that sensor is sensing.

The drive-sense circuits 28 detect the effects on the regulated sourcesignal or power signals as a result of the electrical characteristics ofthe sensors. The drive-sense circuits 28 then generate signalsrepresentative of change to the regulated source signal or power signalbased on the detected effects on the power signals. The changes to theregulated source signals or power signals are representative of theconditions being sensed by the sensors 30.

The drive-sense circuits 28 provide the representative signals of theconditions to the computing device 12-1. A representative signal may bean analog signal or a digital signal. In either case, the computingdevice 12-1 interprets the representative signals to determine thepressure and/or flow rate at each sensor location along the pipeline.The computing device may then provide this information to the server 22,the database 24, and/or to another computing device for storing and/orfurther processing.

As another example of operation, computing device 12-2 is coupled to adrive-sense circuit 28, which is, in turn, coupled to a senor 30. Thesensor 30 and/or the drive-sense circuit 28 may be internal and/orexternal to the computing device 12-2. In this example, the sensor 30 issensing a condition that is particular to the computing device 12-2. Forexample, the sensor 30 may be a temperature sensor, an ambient lightsensor, an ambient noise sensor, etc. As described above, wheninstructed by the computing device 12-2 (which may be a default settingfor continuous sensing or at regular intervals), the drive-sense circuit28 provides the regulated source signal or power signal to the sensor 30and detects an effect to the regulated source signal or power signalbased on an electrical characteristic of the sensor. The drive-sensecircuit generates a representative signal of the affect and sends it tothe computing device 12-2.

In another example of operation, computing device 12-3 is coupled to aplurality of drive-sense circuits 28 that are coupled to a plurality ofsensors 30 and is coupled to a plurality of drive-sense circuits 28 thatare coupled to a plurality of actuators 32. The generally functionalityof the drive-sense circuits 28 coupled to the sensors 30 in accordancewith the above description.

Since an actuator 32 is essentially an inverse of a sensor in that anactuator converts an electrical signal into a physical condition, whilea sensor converts a physical condition into an electrical signal, thedrive-sense circuits 28 can be used to power actuators 32. Thus, in thisexample, the computing device 12-3 provides actuation signals to thedrive-sense circuits 28 for the actuators 32. The drive-sense circuitsmodulate the actuation signals on to power signals or regulated controlsignals, which are provided to the actuators 32. The actuators 32 arepowered from the power signals or regulated control signals and producethe desired physical condition from the modulated actuation signals.

As another example of operation, computing device 12-x is coupled to adrive-sense circuit 28 that is coupled to a sensor 30 and is coupled toa drive-sense circuit 28 that is coupled to an actuator 32. In thisexample, the sensor 30 and the actuator 32 are for use by the computingdevice 12-x. For example, the sensor 30 may be a piezoelectricmicrophone and the actuator 32 may be a piezoelectric speaker.

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice 12 (e.g., any one of 12-1 through 12-x). The computing device 12includes a core control module 40, one or more processing modules 42,one or more main memories 44, cache memory 46, a video graphicsprocessing module 48, a display 50, an Input-Output (I/O) peripheralcontrol module 52, one or more input interface modules 56, one or moreoutput interface modules 58, one or more network interface modules 60,and one or more memory interface modules 62. A processing module 42 isdescribed in greater detail at the end of the detailed description ofthe invention section and, in an alternative embodiment, has a directionconnection to the main memory 44. In an alternate embodiment, the corecontrol module 40 and the I/O and/or peripheral control module 52 areone module, such as a chipset, a quick path interconnect (QPI), and/oran ultra-path interconnect (UPI).

Each of the main memories 44 includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory 44includes four DDR4 (4^(th) generation of double data rate) RAM chips,each running at a rate of 2,400 MHz. In general, the main memory 44stores data and operational instructions most relevant for theprocessing module 42. For example, the core control module 40coordinates the transfer of data and/or operational instructions fromthe main memory 44 and the memory 64-66. The data and/or operationalinstructions retrieve from memory 64-66 are the data and/or operationalinstructions requested by the processing module or will most likely beneeded by the processing module. When the processing module is done withthe data and/or operational instructions in main memory, the corecontrol module 40 coordinates sending updated data to the memory 64-66for storage.

The memory 64-66 includes one or more hard drives, one or more solidstate memory chips, and/or one or more other large capacity storagedevices that, in comparison to cache memory and main memory devices,is/are relatively inexpensive with respect to cost per amount of datastored. The memory 64-66 is coupled to the core control module 40 viathe I/O and/or peripheral control module 52 and via one or more memoryinterface modules 62. In an embodiment, the I/O and/or peripheralcontrol module 52 includes one or more Peripheral Component Interface(PCI) buses to which peripheral components connect to the core controlmodule 40. A memory interface module 62 includes a software driver and ahardware connector for coupling a memory device to the I/O and/orperipheral control module 52. For example, a memory interface 62 is inaccordance with a Serial Advanced Technology Attachment (SATA) port.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and the network(s) 26 via the I/O and/orperipheral control module 52, the network interface module(s) 60, and anetwork card 68 or 70. A network card 68 or 70 includes a wirelesscommunication unit or a wired communication unit. A wirelesscommunication unit includes a wireless local area network (WLAN)communication device, a cellular communication device, a Bluetoothdevice, and/or a ZigBee communication device. A wired communication unitincludes a Gigabit LAN connection, a Firewire connection, and/or aproprietary computer wired connection. A network interface module 60includes a software driver and a hardware connector for coupling thenetwork card to the I/O and/or peripheral control module 52. Forexample, the network interface module 60 is in accordance with one ormore versions of IEEE 802.11, cellular telephone protocols, 10/100/1000Gigabit LAN protocols, etc.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and input device(s) 72 via the input interfacemodule(s) 56 and the I/O and/or peripheral control module 52. An inputdevice 72 includes a keypad, a keyboard, control switches, a touchpad, amicrophone, a camera, etc. An input interface module 56 includes asoftware driver and a hardware connector for coupling an input device tothe I/O and/or peripheral control module 52. In an embodiment, an inputinterface module 56 is in accordance with one or more Universal SerialBus (USB) protocols.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and output device(s) 74 via the output interfacemodule(s) 58 and the I/O and/or peripheral control module 52. An outputdevice 74 includes a speaker, etc. An output interface module 58includes a software driver and a hardware connector for coupling anoutput device to the I/O and/or peripheral control module 52. In anembodiment, an output interface module 56 is in accordance with one ormore audio codec protocols.

The processing module 42 communicates directly with a video graphicsprocessing module 48 to display data on the display 50. The display 50includes an LED (light emitting diode) display, an LCD (liquid crystaldisplay), and/or other type of display technology. The display has aresolution, an aspect ratio, and other features that affect the qualityof the display. The video graphics processing module 48 receives datafrom the processing module 42, processes the data to produce rendereddata in accordance with the characteristics of the display, and providesthe rendered data to the display 50.

FIG. 2 further illustrates sensors 30 and actuators 32 coupled todrive-sense circuits 28, which are coupled to the input interface module56 (e.g., USB port). Alternatively, one or more of the drive-sensecircuits 28 is coupled to the computing device via a wireless networkcard (e.g., WLAN) or a wired network card (e.g., Gigabit LAN). While notshown, the computing device 12 further includes a BIOS (Basic InputOutput System) memory coupled to the core control module 40.

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice 14 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch screen 16, an Input-Output (I/O)peripheral control module 52, one or more input interface modules 56,one or more output interface modules 58, one or more network interfacemodules 60, and one or more memory interface modules 62. The touchscreen 16 includes a touch screen display 80, a plurality of sensors 30,a plurality of drive-sense circuits (DSC), and a touch screen processingmodule 82.

Computing device 14 operates similarly to computing device 12 of FIG. 2with the addition of a touch screen as an input device. The touch screenincludes a plurality of sensors (e.g., electrodes, capacitor sensingcells, capacitor sensors, inductive sensor, etc.) to detect a proximaltouch of the screen. For example, when one or more fingers touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touch screen processing module 82, which may be a separateprocessing module or integrated into the processing module 42.

The touch screen processing module 82 processes the representativesignals from the drive-sense circuits (DSC) to determine the location ofthe touch(es). This information is inputted to the processing module 42for processing as an input. For example, a touch represents a selectionof a button on screen, a scroll function, a zoom in-out function, etc.

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice 18 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch and tactile screen 20, anInput-Output (I/O) peripheral control module 52, one or more inputinterface modules 56, one or more output interface modules 58, one ormore network interface modules 60, and one or more memory interfacemodules 62. The touch and tactile screen 20 includes a touch and tactilescreen display 90, a plurality of sensors 30, a plurality of actuators32, a plurality of drive-sense circuits (DSC), a touch screen processingmodule 82, and a tactile screen processing module 92.

Computing device 18 operates similarly to computing device 14 of FIG. 3with the addition of a tactile aspect to the screen 20 as an outputdevice. The tactile portion of the screen 20 includes the plurality ofactuators (e.g., piezoelectric transducers to create vibrations,solenoids to create movement, etc.) to provide a tactile feel to thescreen 20. To do so, the processing module creates tactile data, whichis provided to the appropriate drive-sense circuits (DSC) via thetactile screen processing module 92, which may be a stand-aloneprocessing module or integrated into processing module 42. Thedrive-sense circuits (DSC) convert the tactile data into drive-actuatesignals and provide them to the appropriate actuators to create thedesired tactile feel on the screen 20.

FIG. 5A is a schematic plot diagram of a computing subsystem 25 thatincludes a sensed data processing module 65, a plurality ofcommunication modules 61A-x, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1. The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing devices in which processing modules 42A-xreside.

A drive-sense circuit 28 (or multiple drive-sense circuits), aprocessing module (e.g., 41A), and a communication module (e.g., 61A)are within a common computing device. Each grouping of a drive-sensecircuit(s), processing module, and communication module is in a separatecomputing device. A communication module 61A-x is constructed inaccordance with one or more wired communication protocol and/or one ormore wireless communication protocols that is/are in accordance with theone or more of the Open System Interconnection (OSI) model, theTransmission Control Protocol/Internet Protocol (TCP/IP) model, andother communication protocol module.

In an example of operation, a processing module (e.g., 42A) provides acontrol signal to its corresponding drive-sense circuit 28. Theprocessing module 42 A may generate the control signal, receive it fromthe sensed data processing module 65, or receive an indication from thesensed data processing module 65 to generate the control signal. Thecontrol signal enables the drive-sense circuit 28 to provide a drivesignal to its corresponding sensor. The control signal may furtherinclude a reference signal having one or more frequency components tofacilitate creation of the drive signal and/or interpreting a sensedsignal received from the sensor.

Based on the control signal, the drive-sense circuit 28 provides thedrive signal to its corresponding sensor (e.g., 1) on a drive & senseline. While receiving the drive signal (e.g., a power signal, aregulated source signal, etc.), the sensor senses a physical condition1-x (e.g., acoustic waves, a biological condition, a chemical condition,an electric condition, a magnetic condition, an optical condition, athermal condition, and/or a mechanical condition). As a result of thephysical condition, an electrical characteristic (e.g., impedance,voltage, current, capacitance, inductance, resistance, reactance, etc.)of the sensor changes, which affects the drive signal. Note that if thesensor is an optical sensor, it converts a sensed optical condition intoan electrical characteristic.

The drive-sense circuit 28 detects the effect on the drive signal viathe drive & sense line and processes the affect to produce a signalrepresentative of power change, which may be an analog or digitalsignal. The processing module 42A receives the signal representative ofpower change, interprets it, and generates a value representing thesensed physical condition. For example, if the sensor is sensingpressure, the value representing the sensed physical condition is ameasure of pressure (e.g., x PSI (pounds per square inch)).

In accordance with a sensed data process function (e.g., algorithm,application, etc.), the sensed data processing module 65 gathers thevalues representing the sensed physical conditions from the processingmodules. Since the sensors 1-x may be the same type of sensor (e.g., apressure sensor), may each be different sensors, or a combinationthereof; the sensed physical conditions may be the same, may each bedifferent, or a combination thereof. The sensed data processing module65 processes the gathered values to produce one or more desired results.For example, if the computing subsystem 25 is monitoring pressure alonga pipeline, the processing of the gathered values indicates that thepressures are all within normal limits or that one or more of the sensedpressures is not within normal limits.

As another example, if the computing subsystem 25 is used in amanufacturing facility, the sensors are sensing a variety of physicalconditions, such as acoustic waves (e.g., for sound proofing, soundgeneration, ultrasound monitoring, etc.), a biological condition (e.g.,a bacterial contamination, etc.) a chemical condition (e.g.,composition, gas concentration, etc.), an electric condition (e.g.,current levels, voltage levels, electro-magnetic interference, etc.), amagnetic condition (e.g., induced current, magnetic field strength,magnetic field orientation, etc.), an optical condition (e.g., ambientlight, infrared, etc.), a thermal condition (e.g., temperature, etc.),and/or a mechanical condition (e.g., physical position, force, pressure,acceleration, etc.).

The computing subsystem 25 may further include one or more actuators inplace of one or more of the sensors and/or in addition to the sensors.When the computing subsystem 25 includes an actuator, the correspondingprocessing module provides an actuation control signal to thecorresponding drive-sense circuit 28. The actuation control signalenables the drive-sense circuit 28 to provide a drive signal to theactuator via a drive & actuate line (e.g., similar to the drive & senseline, but for the actuator). The drive signal includes one or morefrequency components and/or amplitude components to facilitate a desiredactuation of the actuator.

In addition, the computing subsystem 25 may include an actuator andsensor working in concert. For example, the sensor is sensing thephysical condition of the actuator. In this example, a drive-sensecircuit provides a drive signal to the actuator and another drive sensesignal provides the same drive signal, or a scaled version of it, to thesensor. This allows the sensor to provide near immediate and continuoussensing of the actuator's physical condition. This further allows forthe sensor to operate at a first frequency and the actuator to operateat a second frequency.

In an embodiment, the computing subsystem is a stand-alone system for awide variety of applications (e.g., manufacturing, pipelines, testing,monitoring, security, etc.). In another embodiment, the computingsubsystem 25 is one subsystem of a plurality of subsystems forming alarger system. For example, different subsystems are employed based ongeographic location. As a specific example, the computing subsystem 25is deployed in one section of a factory and another computing subsystemis deployed in another part of the factory. As another example,different subsystems are employed based function of the subsystems. As aspecific example, one subsystem monitors a city's traffic lightoperation and another subsystem monitors the city's sewage treatmentplants.

Regardless of the use and/or deployment of the computing system, thephysical conditions it is sensing, and/or the physical conditions it isactuating, each sensor and each actuator (if included) is driven andsensed by a single line as opposed to separate drive and sense lines.This provides many advantages including, but not limited to, lower powerrequirements, better ability to drive high impedance sensors, lower lineto line interference, and/or concurrent sensing functions.

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1. The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing device, devices, in which processingmodules 42A-x reside.

In an embodiment, the drive-sense circuits 28, the processing modules,and the communication module are within a common computing device. Forexample, the computing device includes a central processing unit thatincludes a plurality of processing modules. The functionality andoperation of the sensed data processing module 65, the communicationmodule 61, the processing modules 42A-x, the drive sense circuits 28,and the sensors 1-x are as discussed with reference to FIG. 5A.

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a processing module 42, a plurality of drivesense circuits 28, and a plurality of sensors 1-x, which may be sensors30 of FIG. 1. The sensed data processing module 65 is one or moreprocessing modules within one or more servers 22 and/or one moreprocessing modules in one or more computing devices that are differentthan the computing device in which the processing module 42 resides.

In an embodiment, the drive-sense circuits 28, the processing module,and the communication module are within a common computing device. Thefunctionality and operation of the sensed data processing module 65, thecommunication module 61, the processing module 42, the drive sensecircuits 28, and the sensors 1-x are as discussed with reference to FIG.5A.

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a referencesignal circuit 100, a plurality of drive sense circuits 28, and aplurality of sensors 30. The processing module 42 includes a drive-senseprocessing block 104, a drive-sense control block 102, and a referencecontrol block 106. Each block 102-106 of the processing module 42 may beimplemented via separate modules of the processing module, may be acombination of software and hardware within the processing module,and/or may be field programmable modules within the processing module42.

In an example of operation, the drive-sense control block 104 generatesone or more control signals to activate one or more of the drive-sensecircuits 28. For example, the drive-sense control block 102 generates acontrol signal that enables of the drive-sense circuits 28 for a givenperiod of time (e.g., 1 second, 1 minute, etc.). As another example, thedrive-sense control block 102 generates control signals to sequentiallyenable the drive-sense circuits 28. As yet another example, thedrive-sense control block 102 generates a series of control signals toperiodically enable the drive-sense circuits 28 (e.g., enabled onceevery second, every minute, every hour, etc.).

Continuing with the example of operation, the reference control block106 generates a reference control signal that it provides to thereference signal circuit 100. The reference signal circuit 100generates, in accordance with the control signal, one or more referencesignals for the drive-sense circuits 28. For example, the control signalis an enable signal, which, in response, the reference signal circuit100 generates a pre-programmed reference signal that it provides to thedrive-sense circuits 28. In another example, the reference signalcircuit 100 generates a unique reference signal for each of thedrive-sense circuits 28. In yet another example, the reference signalcircuit 100 generates a first unique reference signal for each of thedrive-sense circuits 28 in a first group and generates a second uniquereference signal for each of the drive-sense circuits 28 in a secondgroup.

The reference signal circuit 100 may be implemented in a variety ofways. For example, the reference signal circuit 100 includes a DC(direct current) voltage generator, an AC voltage generator, and avoltage combining circuit. The DC voltage generator generates a DCvoltage at a first level and the AC voltage generator generates an ACvoltage at a second level, which is less than or equal to the firstlevel. The voltage combining circuit combines the DC and AC voltages toproduce the reference signal. As examples, the reference signal circuit100 generates a reference signal similar to the signals shown in FIG. 7,which will be subsequently discussed.

As another example, the reference signal circuit 100 includes a DCcurrent generator, an AC current generator, and a current combiningcircuit. The DC current generator generates a DC current a first currentlevel and the AC current generator generates an AC current at a secondcurrent level, which is less than or equal to the first current level.The current combining circuit combines the DC and AC currents to producethe reference signal.

Returning to the example of operation, the reference signal circuit 100provides the reference signal, or signals, to the drive-sense circuits28. When a drive-sense circuit 28 is enabled via a control signal fromthe drive sense control block 102, it provides a drive signal to itscorresponding sensor 30. As a result of a physical condition, anelectrical characteristic of the sensor is changed, which affects thedrive signal. Based on the detected effect on the drive signal and thereference signal, the drive-sense circuit 28 generates a signalrepresentative of the effect on the drive signal.

The drive-sense circuit provides the signal representative of the effecton the drive signal to the drive-sense processing block 104. Thedrive-sense processing block 104 processes the representative signal toproduce a sensed value 97 of the physical condition (e.g., a digitalvalue that represents a specific temperature, a specific pressure level,etc.). The processing module 42 provides the sensed value 97 to anotherapplication running on the computing device, to another computingdevice, and/or to a server 22.

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a pluralityof drive sense circuits 28, and a plurality of sensors 30. Thisembodiment is similar to the embodiment of FIG. 5D with thefunctionality of the drive-sense processing block 104, a drive-sensecontrol block 102, and a reference control block 106 shown in greaterdetail. For instance, the drive-sense control block 102 includesindividual enable/disable blocks 102-1 through 102-y. An enable/disableblock functions to enable or disable a corresponding drive-sense circuitin a manner as discussed above with reference to FIG. 5D.

The drive-sense processing block 104 includes variance determiningmodules 104-1 a through y and variance interpreting modules 104-2 athrough y. For example, variance determining module 104-1 a receives,from the corresponding drive-sense circuit 28, a signal representativeof a physical condition sensed by a sensor. The variance determiningmodule 104-1 a functions to determine a difference from the signalrepresenting the sensed physical condition with a signal representing aknown, or reference, physical condition. The variance interpretingmodule 104-1 b interprets the difference to determine a specific valuefor the sensed physical condition.

As a specific example, the variance determining module 104-1 a receivesa digital signal of 1001 0110 (150 in decimal) that is representative ofa sensed physical condition (e.g., temperature) sensed by a sensor fromthe corresponding drive-sense circuit 28. With 8-bits, there are 2⁸(256) possible signals representing the sensed physical condition.Assume that the units for temperature is Celsius and a digital value of0100 0000 (64 in decimal) represents the known value for 25 degreeCelsius. The variance determining module 104-b 1 determines thedifference between the digital signal representing the sensed value(e.g., 1001 0110, 150 in decimal) and the known signal value of (e.g.,0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). Thevariance determining module 104-b 1 then determines the sensed valuebased on the difference and the known value. In this example, the sensedvalue equals 25+86*(100/256)=25+33.6=58.6 degrees Celsius.

FIG. 6 is a schematic block diagram of a drive center circuit 28-acoupled to a sensor 30. The drive sense-sense circuit 28 includes apower source circuit 110 and a power signal change detection circuit112. The sensor 30 includes one or more transducers that have varyingelectrical characteristics (e.g., capacitance, inductance, impedance,current, voltage, etc.) based on varying physical conditions 114 (e.g.,pressure, temperature, biological, chemical, etc.), or vice versa (e.g.,an actuator).

The power source circuit 110 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 116 to the sensor 30. The power sourcecircuit 110 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal, a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The power source circuit 110 generates the power signal 116 to include aDC (direct current) component and/or an oscillating component.

When receiving the power signal 116 and when exposed to a condition 114,an electrical characteristic of the sensor affects 118 the power signal.When the power signal change detection circuit 112 is enabled, itdetects the affect 118 on the power signal as a result of the electricalcharacteristic of the sensor. For example, the power signal is a 1.5voltage signal and, under a first condition, the sensor draws 1 milliampof current, which corresponds to an impedance of 1.5 K Ohms. Under asecond conditions, the power signal remains at 1.5 volts and the currentincreases to 1.5 milliamps. As such, from condition 1 to condition 2,the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms. Thepower signal change detection circuit 112 determines this change andgenerates a representative signal 120 of the change to the power signal.

As another example, the power signal is a 1.5 voltage signal and, undera first condition, the sensor draws 1 milliamp of current, whichcorresponds to an impedance of 1.5 K Ohms. Under a second conditions,the power signal drops to 1.3 volts and the current increases to 1.3milliamps. As such, from condition 1 to condition 2, the impedance ofthe sensor changed from 1.5 K Ohms to 1 K Ohms. The power signal changedetection circuit 112 determines this change and generates arepresentative signal 120 of the change to the power signal.

The power signal 116 includes a DC component 122 and/or an oscillatingcomponent 124 as shown in FIG. 7. The oscillating component 124 includesa sinusoidal signal, a square wave signal, a triangular wave signal, amultiple level signal (e.g., has varying magnitude over time withrespect to the DC component), and/or a polygonal signal (e.g., has asymmetrical or asymmetrical polygonal shape with respect to the DCcomponent). Note that the power signal is shown without affect from thesensor as the result of a condition or changing condition.

In an embodiment, power generating circuit 110 varies frequency of theoscillating component 124 of the power signal 116 so that it can betuned to the impedance of the sensor and/or to be off-set in frequencyfrom other power signals in a system. For example, a capacitancesensor's impedance decreases with frequency. As such, if the frequencyof the oscillating component is too high with respect to thecapacitance, the capacitor looks like a short and variances incapacitances will be missed. Similarly, if the frequency of theoscillating component is too low with respect to the capacitance, thecapacitor looks like an open and variances in capacitances will bemissed.

In an embodiment, the power generating circuit 110 varies magnitude ofthe DC component 122 and/or the oscillating component 124 to improveresolution of sensing and/or to adjust power consumption of sensing. Inaddition, the power generating circuit 110 generates the drive signal110 such that the magnitude of the oscillating component 124 is lessthan magnitude of the DC component 122.

FIG. 6A is a schematic block diagram of a drive center circuit 28-a 1coupled to a sensor 30. The drive sense-sense circuit 28-a 1 includes asignal source circuit 111, a signal change detection circuit 113, and apower source 115. The power source 115 (e.g., a battery, a power supply,a current source, etc.) generates a voltage and/or current that iscombined with a signal 117, which is produced by the signal sourcecircuit 111. The combined signal is supplied to the sensor 30.

The signal source circuit 111 may be a voltage supply circuit (e.g., abattery, a linear regulator, an unregulated DC-to-DC converter, etc.) toproduce a voltage-based signal 117, a current supply circuit (e.g., acurrent source circuit, a current mirror circuit, etc.) to produce acurrent-based signal 117, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The signal source circuit 111 generates the signal 117 to include a DC(direct current) component and/or an oscillating component.

When receiving the combined signal (e.g., signal 117 and power from thepower source) and when exposed to a condition 114, an electricalcharacteristic of the sensor affects 119 the signal. When the signalchange detection circuit 113 is enabled, it detects the affect 119 onthe signal as a result of the electrical characteristic of the sensor.

FIG. 8 is an example of a sensor graph that plots an electricalcharacteristic versus a condition. The sensor has a substantially linearregion in which an incremental change in a condition produces acorresponding incremental change in the electrical characteristic. Thegraph shows two types of electrical characteristics: one that increasesas the condition increases and the other that decreases and thecondition increases. As an example of the first type, impedance of atemperature sensor increases and the temperature increases. As anexample of a second type, a capacitance touch sensor decreases incapacitance as a touch is sensed.

FIG. 9 is a schematic block diagram of another example of a power signalgraph in which the electrical characteristic or change in electricalcharacteristic of the sensor is affecting the power signal. In thisexample, the effect of the electrical characteristic or change inelectrical characteristic of the sensor reduced the DC component but hadlittle to no effect on the oscillating component. For example, theelectrical characteristic is resistance. In this example, the resistanceor change in resistance of the sensor decreased the power signal,inferring an increase in resistance for a relatively constant current.

FIG. 10 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor reduced magnitude of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is impedance of a capacitorand/or an inductor. In this example, the impedance or change inimpedance of the sensor decreased the magnitude of the oscillatingsignal component, inferring an increase in impedance for a relativelyconstant current.

FIG. 11 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor shifted frequency of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is reactance of a capacitorand/or an inductor. In this example, the reactance or change inreactance of the sensor shifted frequency of the oscillating signalcomponent, inferring an increase in reactance (e.g., sensor isfunctioning as an integrator or phase shift circuit).

FIG. 11A is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor changes the frequency of theoscillating component but had little to no effect on the DC component.For example, the sensor includes two transducers that oscillate atdifferent frequencies. The first transducer receives the power signal ata frequency of f₁ and converts it into a first physical condition. Thesecond transducer is stimulated by the first physical condition tocreate an electrical signal at a different frequency f₂. In thisexample, the first and second transducers of the sensor change thefrequency of the oscillating signal component, which allows for moregranular sensing and/or a broader range of sensing.

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit 112 receiving the affected power signal 118 andthe power signal 116 as generated to produce, therefrom, the signalrepresentative 120 of the power signal change. The affect 118 on thepower signal is the result of an electrical characteristic and/or changein the electrical characteristic of a sensor; a few examples of theaffects are shown in FIGS. 8-11A.

In an embodiment, the power signal change detection circuit 112 detect achange in the DC component 122 and/or the oscillating component 124 ofthe power signal 116. The power signal change detection circuit 112 thengenerates the signal representative 120 of the change to the powersignal based on the change to the power signal. For example, the changeto the power signal results from the impedance of the sensor and/or achange in impedance of the sensor. The representative signal 120 isreflective of the change in the power signal and/or in the change in thesensor's impedance.

In an embodiment, the power signal change detection circuit 112 isoperable to detect a change to the oscillating component at a frequency,which may be a phase shift, frequency change, and/or change in magnitudeof the oscillating component. The power signal change detection circuit112 is also operable to generate the signal representative of the changeto the power signal based on the change to the oscillating component atthe frequency. The power signal change detection circuit 112 is furtheroperable to provide feedback to the power source circuit 110 regardingthe oscillating component. The feedback allows the power source circuit110 to regulate the oscillating component at the desired frequency,phase, and/or magnitude.

FIG. 13 is a schematic block diagram of another embodiment of a drivesense circuit 28-b includes a change detection circuit 150, a regulationcircuit 152, and a power source circuit 154. The drive-sense circuit28-b is coupled to the sensor 30, which includes a transducer that hasvarying electrical characteristics (e.g., capacitance, inductance,impedance, current, voltage, etc.) based on varying physical conditions114 (e.g., pressure, temperature, biological, chemical, etc.).

The power source circuit 154 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 158 to the sensor 30. The power sourcecircuit 154 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal or a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal. The power source circuit 154 generates thepower signal 158 to include a DC (direct current) component and anoscillating component.

When receiving the power signal 158 and when exposed to a condition 114,an electrical characteristic of the sensor affects 160 the power signal.When the change detection circuit 150 is enabled, it detects the affect160 on the power signal as a result of the electrical characteristic ofthe sensor 30. The change detection circuit 150 is further operable togenerate a signal 120 that is representative of change to the powersignal based on the detected effect on the power signal.

The regulation circuit 152, when its enabled, generates regulationsignal 156 to regulate the DC component to a desired DC level and/orregulate the oscillating component to a desired oscillating level (e.g.,magnitude, phase, and/or frequency) based on the signal 120 that isrepresentative of the change to the power signal. The power sourcecircuit 154 utilizes the regulation signal 156 to keep the power signalat a desired setting 158 regardless of the electrical characteristic ofthe sensor. In this manner, the amount of regulation is indicative ofthe affect the electrical characteristic had on the power signal.

In an example, the power source circuit 158 is a DC-DC converteroperable to provide a regulated power signal having DC and ACcomponents. The change detection circuit 150 is a comparator and theregulation circuit 152 is a pulse width modulator to produce theregulation signal 156. The comparator compares the power signal 158,which is affected by the sensor, with a reference signal that includesDC and AC components. When the electrical characteristics is at a firstlevel (e.g., a first impedance), the power signal is regulated toprovide a voltage and current such that the power signal substantiallyresembles the reference signal.

When the electrical characteristics changes to a second level (e.g., asecond impedance), the change detection circuit 150 detects a change inthe DC and/or AC component of the power signal 158 and generates therepresentative signal 120, which indicates the changes. The regulationcircuit 152 detects the change in the representative signal 120 andcreates the regulation signal to substantially remove the effect on thepower signal. The regulation of the power signal 158 may be done byregulating the magnitude of the DC and/or AC components, by adjustingthe frequency of AC component, and/or by adjusting the phase of the ACcomponent.

With respect to the operation of various drive-sense circuits asdescribed herein and/or their equivalents, note that the operation ofsuch a drive-sense circuit is operable simultaneously to drive and sensea signal via a single line. In comparison to switched, time-divided,time-multiplexed, etc. operation in which there is switching betweendriving and sensing (e.g., driving at first time, sensing at secondtime, etc.) of different respective signals at separate and distincttimes, the drive-sense circuit is operable simultaneously to performboth driving and sensing of a signal. In some examples, suchsimultaneous driving and sensing is performed via a single line using adrive-sense circuit.

In addition, other alternative implementations of various drive-sensecircuits are described in U.S. Utility patent application Ser. No.16/113,379, entitled “DRIVE SENSE CIRCUIT WITH DRIVE-SENSE LINE”, filedAug. 27, 2018, pending. Any instantiation of a drive-sense circuit asdescribed herein may also be implemented using any of the variousimplementations of various drive-sense circuits described in U.S.Utility patent application Ser. No. 16/113,379.

In addition, note that the one or more signals provided from adrive-sense circuit (DSC) may be of any of a variety of types. Forexample, such a signal may be based on encoding of one or more bits togenerate one or more coded bits used to generate modulation data (orgenerally, data). For example, a device is configured to perform forwarderror correction (FEC) and/or error checking and correction (ECC) codeof one or more bits to generate one or more coded bits. Examples of FECand/or ECC may include turbo code, convolutional code, turbo trelliscoded modulation (TTCM), low density parity check (LDPC) code,Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, and Hocquenghem)code, binary convolutional code (BCC), Cyclic Redundancy Check (CRC),and/or any other type of ECC and/or FEC code and/or combination thereof,etc. Note that more than one type of ECC and/or FEC code may be used inany of various implementations including concatenation (e.g., first ECCand/or FEC code followed by second ECC and/or FEC code, etc. such asbased on an inner code/outer code architecture, etc.), parallelarchitecture (e.g., such that first ECC and/or FEC code operates onfirst bits while second ECC and/or FEC code operates on second bits,etc.), and/or any combination thereof.

Also, the one or more coded bits may then undergo modulation or symbolmapping to generate modulation symbols (e.g., the modulation symbols mayinclude data intended for one or more recipient devices, components,elements, etc.). Note that such modulation symbols may be generatedusing any of various types of modulation coding techniques. Examples ofsuch modulation coding techniques may include binary phase shift keying(BPSK), quadrature phase shift keying (QPSK), 8-phase shift keying(PSK), 16 quadrature amplitude modulation (QAM), 32 amplitude and phaseshift keying (APSK), etc., uncoded modulation, and/or any other desiredtypes of modulation including higher ordered modulations that mayinclude even greater number of constellation points (e.g., 1024 QAM,etc.).

In addition, note that a signal provided from a DSC may be of a uniquefrequency that is different from signals provided from other DSCs. Also,a signal provided from a DSC may include multiple frequenciesindependently or simultaneously. The frequency of the signal can behopped on a pre-arranged pattern. In some examples, a handshake isestablished between one or more DSCs and one or more processing module(e.g., one or more controllers) such that the one or more DSC is/aredirected by the one or more processing modules regarding which frequencyor frequencies and/or which other one or more characteristics of the oneor more signals to use at one or more respective times and/or in one ormore particular situations.

With respect to any signal that is driven and simultaneously detected bya DSC, note that any additional signal that is coupled into a line, anelectrode, a touch sensor, a bus, a communication link, a battery, aload, an electrical coupling or connection, etc. associated with thatDSC is also detectable. For example, a DSC that is associated with sucha line, an electrode, a touch sensor, a bus, a communication link, abattery, a load, an electrical coupling or connection, etc. isconfigured to detect any signal from one or more other lines,electrodes, touch sensors, buses, communication links, loads, electricalcouplings or connections, etc. that get coupled into that line,electrode, touch sensor, bus, communication link, battery, load,electrical coupling or connection, etc.

Note that the different respective signals that are driven andsimultaneously sensed by one or more DSCs may be are differentiated fromone another. Appropriate filtering and processing can identify thevarious signals given their differentiation, orthogonality to oneanother, difference in frequency, etc. Other examples described hereinand their equivalents operate using any of a number of differentcharacteristics other than or in addition to frequency.

Moreover, with respect to any embodiment, diagram, example, etc. thatincludes more than one DSC, note that the DSCs may be implemented in avariety of manners. For example, all of the DSCs may be of the sametype, implementation, configuration, etc. In another example, the firstDSC may be of a first type, implementation, configuration, etc., and asecond DSC may be of a second type, implementation, configuration, etc.that is different than the first DSC. Considering a specific example, afirst DSC may be implemented to detect change of impedance associatedwith a line, an electrode, a touch sensor, a bus, a communication link,an electrical coupling or connection, etc. associated with that firstDSC, while a second DSC may be implemented to detect change of voltageassociated with a line, an electrode, a touch sensor, a bus, acommunication link, an electrical coupling or connection, etc.associated with that second DSC. In addition, note that a third DSC maybe implemented to detect change of a current associated with a line, anelectrode, a touch sensor, a bus, a communication link, an electricalcoupling or connection, etc. associated with that DSC. In general, whilea common reference may be used generally to show a DSC or multipleinstantiations of a DSC within a given embodiment, diagram, example,etc., note that any particular DSC may be implemented in accordance withany manner as described herein, such as described in U.S. Utility patentapplication Ser. No. 16/113,379, etc. and/or their equivalents.

Note that certain of the following diagrams show one or more processingmodules. In certain instances, the one or more processing modules isconfigured to communicate with and interact with one or more otherdevices including one or more of DSCs, one or more components associatedwith a DSC, input electric power, and/or one or more other components.Note that any such implementation of one or more processing modules mayinclude integrated memory and/or be coupled to other memory. At leastsome of the memory stores operational instructions to be executed by theone or more processing modules. In addition, note that the one or moreprocessing modules may interface with one or more other devices,components, elements, etc. via one or more communication links,networks, communication pathways, channels, etc.

In addition, when a DSC is implemented to communicate with and interactwith another element, the DSC is configured simultaneously to transmitand receive one or more signals with the element. For example, a DSC isconfigured simultaneously to sense and to drive one or more signals tothe one element. During transmission of a signal from a DSC, that sameDSC is configured simultaneously to sense the signal being transmittedfrom the DSC and any other signal may be coupled into the signal that isbeing transmitted from the DSC.

FIG. 14 is a schematic block diagram of an embodiment 1400 of variousdevices including a device 1409 that is operative to transfer powerwirelessly in accordance with the present invention. As with manydiagram herein, this diagram shows one or more processing modules 42configured to interact with a drive-sense circuit (DSC) 28. Note thatthe coupling or connection between one or more processing modules 42 andthe DSC 28 may be made using any number of communication channels,pathways, etc. (e.g., generally n, where n is a positive integer greaterthan or equal to 1). Examples of one or more signals that may beprovided from the one or more processing modules 42 to the DSC mayinclude any one or more of the reference signal (e.g., referred to asVref in certain diagrams), power input, communication signaling,interfacing, control signaling, digital information provided from theDSC 28, digital information provided from the one or more processingmodules 42, etc. In some examples, the DSC 28 itself includes a signalgenerator whose operation is controlled by the one or more processingmodules 42 such as setting one or more parameters of the referencesignal to be generated and used as a basis to generate the drive signal.

The DSC 28 is implemented to generate a drive signal based on areference signal into provided via a single line through a resonatingcapacitor 1402 to a first coil. The first coil is operative tofacilitate electromagnetic (inductive) coupling with a second coil whenthe first clone the second coil or within sufficient proximity to do so.Generally speaking, the efficacy of electromagnetic coupling between thefirst coil the second coil is a function of the proximity between thefirst coil and the second coil. For example, consider the spacingbetween the first coil and the second coil to be separated by a distancethat is inadequate to facilitate electromagnetic (inductive) couplingbetween the first coil and the second coil, then there will be verylittle electromagnetic (inductive) coupling. However, when the firstcoil and the second coil are within sufficient proximity such as tofacilitate electromagnetic (inductive) coupling, then energy, power,signals, etc. may be transferred between the first coil the second coil,and vice versa.

In some examples, note that a magnetic core may be implemented in such away as to increase the efficacy of the electromagnetic (inductive)coupling between the first and second coil. For example, such a magneticcore may be implemented within one or both of the devices 1409 and 1410that include the first coil and the second coil if desired in certainexamples.

In this diagram, consider the first coil included in a first device 1409that includes and/or is associated with the DSC 28, the resonatingcapacitor 1402, and the one or more processing modules 42, and considerthe second coil included in the second device 1410 that includes awireless receiver 1421 that is operative to receive power coupled fromthe first coil to the second coil, and that also includes one or moreother device components 1499. Examples of such device components mayinclude any one or more of one or more processing modules, circuitry,battery, load, etc. as may be found in any of a number of differenttypes of devices. Examples of the device 1410 may include any one ormore of a laptop computer, a cell phone, an electronic pad device, apersonal digital assistant, a portable music devices, a portable mediaplayers, a tablet, a digital camera, and/or any other type of device. Incertainties and both of the device 1410, the device 1410 includes abattery that is charged via wireless power transfer from the first coilto the second coil after having undergone processing via the wirelessreceiver 1421. In some examples, the wireless receiver 1421 is operativeto generate a DC signal from an AC signal that is provided wirelesslyfrom the first coil to the second coil.

Generally speaking, energy is transferred from the first coil to thesecond coil when a time varying signal, such as an AC signal, isprovided to the first coil. The time varying excitation facilitateselectromagnetic (inductive) coupling of the first coil second coil. Forexample, a time varying excitation signal provided to the first coilwill induce a voltage in the second coil. Considering transformer theoryas applied to electromagnetic (inductive) coupling between the firstcoil the second coil, consider that the first coil has a first number ofturns, N1, and the second coil has a second number of turns, N2, then atime varying voltage, v1(t), applied across the first coil will induce atime varying voltage, v2(t), across the second coil based on therelationship of:v2(t)=(N1/N1) v1(t)

As mentioned above, while a magnetic core may be implemented to increasethe efficacy of the electromagnetic (inductive) coupling between thefirst and second coil, it is not required. In addition, consideringtransformer theory in an ideal situation, consider two coils that areimplemented such as to facilitate electromagnetic (inductive) couplingbetween them, and assuming perfect flux linkage between the two coils,then the mutual inductance, M, between them may be provided as follows:

M=(μ₀×N1×N2×A)/l in Henries, where

μ₀ is the permeability of free space, approx. 4π×10⁻⁷ H/m

N1 has a first number of turns in the first coil

N2 has a second number of turns in the second coil

A is the cross-sectional area of electromagnetic (inductive) couplingbetween the first coil and the second coil in square meters (m²)

l is the length of the first and second coils in meters (m), assumingsame length in this example.

Considering an example in which an iron core is implemented tofacilitate greater electromagnetic (inductive) coupling between thefirst coil and second coil, then

then the mutual inductance, M, between them may be provided as follows:

M=(μ₀ ×μ_(r)×N1×N2×A)/l in Henries, where

μ₀ is the permeability of free space, approx. 4π×10⁻⁷ H/m

μ_(r) is the relative permeability of the iron core in H/m

N1 has a first number of turns in the first coil

N2 has a second number of turns in the second coil

A is the cross-sectional area of electromagnetic (inductive) couplingbetween the first coil and the second coil in square meters (m²)

l is the length of the first and second coils in meters (m), assumingsame length in this example.

Note that such examples consider an ideal amount of electromagnetic(inductive) coupling between the first coil and the second coil.However, in a real life implementation, there will be some loss due toleakage and imperfect positioning of the first coil relative to thesecond coil. As such, the electromagnetic (inductive) coupling betweenthe first coil and the second coil will never be perfect or 100%effective, but proper arrangement of the first coil and the second coilcan increase the efficacy of the electromagnetic (inductive) coupling,including ensuring that the first coil and the second coil are withinsufficient proximity such as to facilitate electromagnetic (inductive)coupling. In some instances, a scale factor, k, is used to represent theactual mutual inductance between the first coil and the second coil as afunction of an ideal mutual inductance, M_(ideal), such thatM=k×M_(ideal). In some instances, two coils that are perfectly coupledwill have a scale factor of k=1; a scale factor of k>0.5 may beassociated with tightly coupled coils, and a scale factor of k<0.5 maybe associated with loosely coupled coils.

Using a DSC 28 as described herein, any of one or more electricalcharacteristics associated with the drive signal is provided via thesingle line and via the resonating capacitor 1402 the first coil may besensed/detected via the single line simultaneously/concurrently as thedrive signal is provided from the DSC 28.

In an example of operation and implementation, the first coil isincluded within a device 1409 that is operative to transfer powerwirelessly to a second coil included in device 1401. The device 1409includes a DSC 28, memory that stores operational instructions, and oneor more processing modules 42 operably coupled to the DSC and the memory(or alternatively, the one or more processing modules 42 includes thememory). The DSC 28 is operably coupled to receive a reference signaland to generate a drive signal based on the reference signal. Whenenabled, the DSC operably coupled and configured to provide the drivesignal to a first coil via a single line and via a resonating capacitor1402 and simultaneously to sense the drive signal via the single line.Based on the first coil being in a proximity to a second coil associatedwith another device 1410-1 that facilitates electromagnetic couplingbetween the first coil and the second coil, the drive signal isoperative to transfer power wirelessly from the first coil to the secondcoil. In addition, the DSC 28 is configured to perform sensing of thedrive signal via the single line that includes detection of one or moreelectrical characteristics of the drive signal. The DSC 28 is configuredto generate a digital signal representative of the one or moreelectrical characteristics of the drive signal based on an error signalcorresponding to a difference between the drive signal and the referencesignal.

The one or more processing module, when enabled, is configured toexecute the operational instructions to generate the reference signaland to process the digital signal representative of the one or moreelectrical characteristics of the drive signal to determine the one ormore electrical characteristics of the drive signal.

In some examples, the one or more processing modules 42 is alsoconfigured to adapt at least one parameter of the reference signal basedon the one or more electrical characteristics of the drive signal.Examples of the at least one parameter of the reference signal mayinclude any one or more of a magnitude, a frequency, a signal type, awaveform type, or a phase. In some examples, the one or more processingmodules 42 is configured to generate the reference signal as asinusoidal signal. Also, in certain examples, the one or more processingmodules 42 is configured to adapt an amplitude of the reference signalbased on the one or more electrical characteristics of the drive signalto maximize the error signal. In addition, in some examples, the one ormore processing modules 42 is configured to generate the referencesignal to have a frequency that is based on a resonant frequencyassociated with an inductance of the first coil and a capacitance of theresonating capacitor.

In an alternative example of operation and implementation, the firstcoil is included within a device 1409 that is operative to transferpower wirelessly to a second coil included in another device 1410. Thedevice 1409 includes a DSC 28, memory that stores operationalinstructions, and one or more processing modules 42 operably coupled tothe DSC and the memory (or alternatively, the one or more processingmodules 42 includes the memory). The DSC 28 is operably coupled toreceive a reference signal and to generate a drive signal based on thereference signal. When enabled, the DSC operably coupled and configuredto provide the drive signal to a first coil via a single line and via aresonating capacitor 1402 and simultaneously to sense the drive signalvia the single line. Based on the first coil of the device 1409 being ina proximity to a second coil associated with another device 1410 thatfacilitates electromagnetic coupling between the first coil and thesecond coil, the drive signal is operative to transfer power wirelesslyfrom the first coil to the second coil. In addition, the DSC 28 isconfigured to perform sensing of the drive signal via the single linethat includes detection of one or more electrical characteristics of thedrive signal. the DSC 28 is configured to generate a digital signalrepresentative of the one or more electrical characteristics of thedrive signal based on an error signal corresponding to a differencebetween the drive signal and the reference signal.

The one or more processing modules 42, when enabled, is configured toexecute the operational instructions to generate the reference signaland process the digital signal representative of the one or moreelectrical characteristics of the drive signal to determine the one ormore electrical characteristics of the drive signal including todetermine whether a signal associated with the other device 1410 iscoupled into the drive signal thereby indicating presence of the otherdevice 1410 within the proximity to the device 1409 that facilitateselectromagnetic coupling between the first coil and the second coil.Note that the electromagnetic (inductive) coupling between the firstcoil and the second coil, and the functionality and operation of the DSC28, facilitates detection of the presence of one or more additionalsignals including any other signal may be coupled into the first coil.

For example, as the device 1410 is in operation, it may generate one ormore signals that may be detected and coupled into the first coil. Fromcertain perspectives, the first coil may be viewed as operating as acomponent (e.g., an antenna, an electrode, etc.) that facilitates thecoupling of one or more signals generated by the device 1410 as it is inoperation. Certain examples of such signals may include interaction ofthe device 1410 with another device in communication (e.g., consider thedevice 1410 is a cellular telephone communicating with a cellulartower/base station, or alternatively that the device 1410 is a cellulartelephone or consider the device 1410 is a laptop computer communicatingwith a Wi-Fi hotspot, etc.). The one or more processing modules 42 isconfigured to perform detection of any such one or more additionalsignals associated with a device 1410 that is appropriate for wirelesstransfer of power via the first coil to the second coil to validate thepresence of such a device that is appropriate for wireless transfer ofpower. For example, based on determination that a signal associated withthe other device 1410 is coupled into the drive signal, the one or moreprocessing modules 42 is configured to continue to provide the referencesignal to the DSC 28 to facilitate wireless power transfer from thefirst coil to the second coil in accordance with charging of a batteryof the other device 1410.

However, based on determination that no signal associated with the otherdevice 1410 is coupled to the drive signal, the one or more processingmodules 42 is configured to perform one or more alternative functions.In one example, the one or more processing modules 42 is configured toadjust an amplitude of the reference signal to zero to stop the DSC 28from providing the drive signal to the first coil via the single line invia the resonating capacitor 1402. For example, consider a determinationthat no signal associated with any such other device 1410 that isappropriate for wireless transfer of power is coupled into the drivesignal, then the one or more processing modules 42 is configured todetect that no such other device 1410 that is appropriate for wirelesstransfer of power is present, and the one or more processing modules 42executes one or more appropriate actions. In one example, this involvescessation of providing the drive signal from the DSC 28.

Note that operation may resume subsequently to determine whether or notanother device 1410 that is appropriate for wireless transfer of poweris within sufficient proximity to the device that includes the firstcoil (e.g., by once again providing of a reference signal from the oneor more processing modules 42, by once again the providing of a drivesignal from the DSC 28, etc.). Based on the determination that such adevice 1410 that is appropriate for wireless transfer power is present,the one or more processing modules 42 is configured to continue toprovide the reference signal to the DSC to facilitate wireless powertransfer from the first coil to the second coil in accordance withcharging of a battery of the other device 1410.

FIG. 15 is a schematic block diagram of an embodiment 1500 of variousdevices including a device 1409 that is operative to transfer power andcommunicate wirelessly in accordance with the present invention. Thisdiagram has certain similarities to the previous diagram with at leastone difference being that the wireless transceiver 1422 is implementedwithin a device 1410-1 that includes a second coil. This wirelesstransceiver 1422 is operative not only to receive power wirelessly fromthe device 1409 that includes the first coil, but is also operative tofacilitate communication with that other device 1409 via theelectromagnetic (inductive) coupling between the first coil and thesecond coil. For example, the wireless transceiver 1422 is operative notonly to receive power that is provided via a drive signal provided fromthe DSC 28 via the single line via the resonating capacitor 1402 and theelectromagnetic (inductive) coupling between the first coil and thesecond coil, but is also operative to receive one or more communicationsignals from the DSC 28 via that same pathway and also to transmit oneor more communication signals to the DSC 28 via that same pathway. Thisdiagram shows an example by which communication is supported from onedevice (e.g., device 1409) that includes the first coil and also from asecond device that includes a second coil (e.g., device 1410-1).

In an example of operation and implementation, the first coil isincluded within a device 1409 that is operative to transfer power andcommunicate wirelessly. The device 1409 includes a DSC 28, memory thatstores operational instructions, and one or more processing modules 42operably coupled to the DSC and the memory (or alternatively, the one ormore processing modules 42 includes the memory).

When enabled, the DSC 28 is operably coupled and configured to providethe drive signal to a first coil via a single line and via a resonatingcapacitor 1402 and simultaneously to sense the drive signal via thesingle line. Based on the first coil being in a proximity to a secondcoil associated with another device 1410-1 that facilitateselectromagnetic coupling between the first coil and the second coil, thedrive signal is operative to transfer power wirelessly from the firstcoil to the second coil. The DSC 28 is also configured to performsensing of the drive signal via the single line that includes detectionof one or more electrical characteristics of the drive signal includingdetection of whether a communication signal is transmitted from theother device 1410-1 to the device 1409 via the electromagnetic couplingbetween the first coil and the second coil. In this diagram, note thatthe device 1410-1 includes a wireless transceiver 1422 that is operativeto transmit one or more signals via the second coil that is coupled intothe first coil and that may be detected by the DSC 28.

The DSC 28 is also configured to generate a digital signalrepresentative of the one or more electrical characteristics of thedrive signal based on an error signal corresponding to a differencebetween the drive signal and the reference signal.

When enabled, the one or more processing modules 42 is configured toexecute the operational instructions to generate the reference signaland to process the digital signal representative of the one or moreelectrical characteristics of the drive signal to determine the one ormore electrical characteristics of the drive signal including todetermine whether the communication signal is transmitted from the otherdevice 1410-1 to the device 1409 via the electromagnetic couplingbetween the first coil and the second coil.

Based on determination that the communication signal is transmitted fromthe other device 1410-1 to the device 1409 that includes the first coil,the one or more processing modules 42 is configured to process thedigital signal to interpret control information from the communicationsignal. The one or more processing modules 42 is configured to executeone or more operations based on the control information that isinterpreted. For example, in one example, the one or more processingmodules 42 is configured to adapt at least one parameter of thereference signal based on the control information. Examples of the atleast one parameter of the reference signal may include any one or moreof a magnitude, a frequency, a signal type, a waveform type, or a phase.

Alternatively, based on determination that no communication signal istransmitted from the other device 1410-1 to the device 1409, the one ormore processing modules 42 is configured to execute one or moreoperations. In some examples, the one or more processing modules 42 isconfigured to adjust an amplitude of the reference signal to zero tostop the DSC from providing the drive signal to the first coil via thesingle line and via the resonating capacitor.

In some examples, based on determination that the communication signalis transmitted from the another device to the device, the one or moreprocessing modules 42 is configured to continue to provide the referencesignal to the DSC to facilitate wireless power transfer from the firstcoil to the second coil in accordance with charging of a battery of theanother device (e.g., a battery included in device 1410-1). Note thatthe communication signal includes information indicating presence of theanother device within the proximity to the device that facilitateselectromagnetic coupling between the first coil and the second coil.

In even other examples, the one or more processing modules 42 isconfigured process the digital signal representative of the one or moreelectrical characteristics of the drive signal to determine the one ormore electrical characteristics of the drive signal including todetermine whether another communication signal is transmitted from theanother device to the device via the electromagnetic coupling betweenthe first coil and the second coil. Based on determination that theanother communication signal is transmitted from the another device tothe device, the one or more processing modules 42 is configured toprocess the digital signal to interpret additional control informationfrom the another communication signal. Also, based on determination thatthe additional control information indicates a charged status of abattery of the another device, the one or more processing modules 42 isconfigured to adjust an amplitude of the reference signal to zero tostop the DSC from providing the drive signal to the first coil via thesingle line and via the resonating capacitor.

In an alternative example of operation and implementation, the firstcoil is included within a device 1409 that is operative to transferpower and communicate wirelessly. The device 1409 includes a DSC 28,memory that stores operational instructions, and one or more processingmodules 42 operably coupled to the DSC and the memory (or alternatively,the one or more processing modules 42 includes the memory).

When enabled, the DSC 28 is operably coupled to receive a referencesignal and to generate a drive signal based on the reference signal.When enabled, the DSC operably coupled and configured to provide thedrive signal to a first coil via a single line and via a resonatingcapacitor 1402 and simultaneously to sense the drive signal via thesingle line. Based on the first coil being in a proximity to a secondcoil associated with another device 1410-1 that facilitateselectromagnetic coupling between the first coil and the second coil, thedrive signal is operative to transfer power wirelessly from the firstcoil to the second coil. The DSC is also configured to perform sensingof the drive signal via the single line includes detection of one ormore electrical characteristics of the drive signal including detectionof whether a communication signal is transmitted from the other device1410-1 to the device 1409 via the electromagnetic coupling between thefirst coil and the second coil. In this diagram, note that the device1410-1 includes a wireless transceiver 1422 that is operative totransmit one or more signals via the second coil that is coupled intothe first coil and that may be detected by the DSC 28. The DSC 28 isalso configured to generate a digital signal representative of the oneor more electrical characteristics of the drive signal based on an errorsignal corresponding to a difference between the drive signal and thereference signal.

The DSC 28 is also configured to generate a digital signalrepresentative of the one or more electrical characteristics of thedrive signal based on an error signal corresponding to a differencebetween the drive signal and the reference signal.

When enabled, the one or more processing modules 42 is configured toexecute the operational instructions to generate the reference signal.The one or more processing modules 42 is also configured to process thedigital signal representative of the one or more electricalcharacteristics of the drive signal to determine the one or moreelectrical characteristics of the drive signal including to determinewhether the communication signal is transmitted from the other device1410-1 to the device 1409 via the electromagnetic coupling between thefirst coil and the second coil.

Based on determination that the communication signal is transmitted fromthe other device 1410-1 to the device 1409, the one or more processingmodules 42 is also configured to continue to provide the referencesignal to the DSC to facilitate wireless power transfer from the firstcoil to the second coil in accordance with charging of a battery of theother device 1410-1. Note that the communication signal includesinformation indicating presence of the other device 1410-1 within theproximity to the device 1409 that facilitates electromagnetic couplingbetween the first coil and the second coil.

Also, in certain other examples, the one or more processing modules 42is also configured process the digital signal representative of the oneor more electrical characteristics of the drive signal to determine theone or more electrical characteristics of the drive signal including todetermine whether another communication signal is transmitted from theanother device to the device via the electromagnetic coupling betweenthe first coil and the second coil. Based on determination that theanother communication signal is transmitted from the another device tothe device, the one or more processing modules 42 is also configured toprocess the digital signal to interpret additional control informationfrom the another communication signal. Based on determination that theadditional control information indicates a charged status of a batteryof the another device, the one or more processing modules 42 is alsoconfigured to adjust an amplitude of the reference signal to zero tostop the DSC from providing the drive signal to the first coil via thesingle line and via the resonating capacitor.

In even other examples, the one or more processing modules 42 is alsoconfigured to process the digital signal representative of the one ormore electrical characteristics of the drive signal to determine the oneor more electrical characteristics of the drive signal including todetermine whether another communication signal is transmitted from theanother device to the device via the electromagnetic coupling betweenthe first coil and the second coil. Based on determination that theanother communication signal is transmitted from the another device tothe device, the one or more processing modules 42 is also configured toprocess the digital signal to interpret additional control informationfrom the another communication signal. Based on determination that theadditional control information includes an instruction from the anotherdevice to adapt at least one parameter of the reference signal, adaptthe at least one parameter of the reference signal based on theinstruction. Note that the at least one parameter of the referencesignal may include any one or more of a magnitude, a frequency, a signaltype, a waveform type, or a phase.

FIG. 16 is a schematic block diagram of an embodiment 1600 of variousdevices including a prior art device 1408 that is operative to transferpower wirelessly in accordance with the present invention. This diagramhas some similarities to other diagrams herein with at least onedifference being that the first coil is included within a prior artdevice 1408. In addition, note that the second coil is included within adevice 1410-3 that may be implemented to include a wireless receiver1421 and/or a wireless transceiver 1422 as described herein. Inaddition, one or more additional device components 1499 are alsoincluded within the device 1410-3 as described herein.

In this diagram, a prior art device 1408 includes a transmit controller1610 that is operative to generate a square wave to be provided viaswitching transistors such as MOSFETs (e.g., such as shown a P-typeMOSFET as being connected to a power supply (e.g., Vdd) and an and-typeMOSFET as having a source connected to ground. The transmit controller1610 is operative to control the switching of the gates of these MOSFETsto generate a square wave AC signal that is provided via the resonatingcapacitor 1402 to the first coil. In addition, note that a sensingresistor, R_sense, is coupled to the other end of the first coil so asto be able to detect a feedback signal, I_feedback, as may be providedfrom a wireless transceiver 1422 to the prior art device 1408 thatincludes the first coil. In such a prior art implementation, note thatthe value of a sensing resistor, R_sense, needs to be scaledappropriately to be able to handle the full amount of current that maybe provided to the first coil. Based on current passing through thesensing resistor, R_sense, a voltage is generated, V_feedback, and isdetected by the transmit controller 1610.

Note that various embodiments, examples, etc. included herein and theirequivalents, obviates the need for any such sensing resistor, R_sense,at least in part, because of the operation of a DSC 28. In such a priorart implementation, the sensing resistor, R_sense, can cause excessiveheating within a the prior art device 1408 that includes the first coil.Instead, implementing a device in accordance with various aspects,embodiments, and/or examples of the invention (and/or their equivalents)as described herein obviates the need for any such sensing resistor,R_sense, thereby providing a number of benefits and improvements overthe prior art including a reduction in number of components and areduction in amount of heating.

In addition, in certain embodiments, examples, etc. included herein andtheir equivalents, the reference signal and drive signal may besinusoidal of a pure tone nature, such as having a singular frequency.Other examples may include signals having multiple frequency is therein. Considering a sinusoidal signal of the pure tone nature, such ashaving a singular frequency, no harmonics are generated as mayunfortunately be generated using the switching transistors includedwithin such a prior art device 1408. In general, note that the referencesignal as described herein to be used within a DSC may have any form(e.g., sinusoidal, square wave, triangle wave, etc.). If desired, andarchitecture such as the switching transistors included within thediagram could be used to generate a reference signal to be used within aDSC.

FIG. 17 is a schematic block diagram of an embodiment 1700 of variousdevices including a device 1409-1 that is operative to transfer powerwirelessly and/or transfer power and communicate wirelessly inaccordance with the present invention. This diagram also has somesimilarities to other diagrams herein such that the second coil isincluded with the device 1410-3 that may be implemented to include awireless receiver 1421 and/or a wireless transceiver 1422 as describedherein.

This diagram also provides an alternative implementation by which a DSC28 may be implemented, as shown by DSC 28-17. As with other embodiments,examples, etc. herein, one or more processing modules 42 is implementedto interact and communicate with the DSC 28-17 in this diagram. The DSC28-17 includes a signal generator 1710 that is configured to receive acontrol signal from the one or more processing modules 42 that specifiesone or more parameters of the reference signal. Examples of one or moreparameters of the reference signal may include any one or more ofamplitude/magnitude, frequency, type, waveform, phase, etc. Note thatthe reference signal may include more than one frequency. In addition,note that the reference signal may be of any desired type and having anydesired waveform. For example, in some examples, the reference signal isa sinusoidal signal. However, note that the reference signal may be anyother type of signal including square wave signal, triangle wave signal,sawtooth signal, etc., as just some examples of types and waveforms ofsignals.

In addition, in this diagram as well as others that pictorially show asignal generator 1710, note that any alternative examples may excludesuch a signal generator 1710 within such as implementation of a DSC, andthe one or more processing modules 42 may be configured to provide thereference signal directly to the DSC. For example, the one or moreprocessing modules 42 may include functionality of such a signalgenerator 1710 therein and the functionality to generate a referencesignal having any such desired parameters.

The reference signal is provided to an input of a comparator 1715, whichmay alternatively be implemented as an operational amplifier. Anotherinput of the comparator 1715 receives the drive signal that is alsoprovided via the single line via the resonating capacitor 1402 to thefirst coil. The drive signal is generated by a dependent current supplythat is powered by a power supply (e.g., Vdd) and that is controlledbased on an error signal, Ve, that is generated by the comparator 1415as it compares the drive signal to the reference signal. In thisdiagram, the error signal is passed through and analog to digitalconverter (ADC) 1760 to generate a digital signal that is representativeof one or more electrical characteristics of the drive signal. Thedigital signal is provided to the one or more processing modules 42 andalso provided to a DAC 1762 to generate an analog control signal thatcontrols the amount of current that is output from the dependent currentsupply via the single-line. Note that the amount of current, i, that isoutput from the dependent current supply based on the error signal, Ve,is a function of a programmable scale factor, k, of the dependentcurrent supply such that: i=k×Ve. In certain examples, note also thatthe one or more processing modules 42 is configured to adjust aprogrammable gain of the dependent current supply. Note that scaling theprogrammable gain of the dependent current supply provides for scalingof the error signal, Ve. Control of the current, i, and him that isoutput from the dependent current supply may be effectuated byappropriate control of the reference signal as well as the programmablegain of the dependent current supply.

In this diagram that shows a dependent current supply, note that a poweramplifier, such as a high efficiency power amplifier, may alternativelybe implemented in place of such a dependent current source (e.g., asshown in FIG. 25 herein). The control of such a power amplifier may beeffectuated in a similar manner based on the error signal, Ve, that isgenerated by the comparator 1415 as it compares the drive signal to thereference signal.

FIG. 18 is a schematic block diagram of another embodiment 1800 ofvarious devices including a device 1409-2 that is operative to transferpower wirelessly and/or transfer power and communicate wirelessly inaccordance with the present invention. This diagram is similar to theprior diagram with at least one difference being that a DSC 28-18employs an analog control signal that controls the amount of currentthat is output from the dependent current supply via the single-lineline is provided directly based on the error signal, Ve, that isgenerated from the comparator 1715. Note that this diagram does notinclude or require the DAC 1762 as shown in the prior diagram.

FIG. 19 is a schematic block diagram of another embodiment 1900 ofvarious devices including a device 1409-3 that is operative to transferpower wirelessly and/or transfer power and communicate wirelessly inaccordance with the present invention. This diagram is similar to theprior two diagrams with at least one difference being that a DSC 28-19is shown as employing an analog control signal that controls the amountof current that is output from the dependent current supply via thesingle-line is provided directly based on the error signal, Ve, that isgenerated from the comparator 1715 or alternatively employing an analogcontrol signal for such purposes as being provided from a DAC 1762 thatreceives the digital signal output from the ADC 1760. Note that eitherimplementation may be used in various examples. In certain of thefollowing diagrams as well, both such possible implementations areshown.

In this diagram, a device 1410-4 that includes the second coil includesa capacitor 1902 that is connected in line with one of the terminals ofthe second coil. The two respective terminals of the second coil areprovided to a rectifier 1910, which is shown as a full wave rectifier inthis example including four respective diodes, which may be implementedas power diodes, and are configured to generate a DC signal from an ACsignal that is provided via the two terminals of the second coil. Inaddition, this DC signal is filtered via a filtering/rectifyingcapacitor, Crect, to generate a rectified DC voltage, V_rect, and isalso passed through a voltage regulator 1920 whose operation iscontrolled by a linear controller 1922, to generate an output DC signalthat is appropriate and suitable for the one or more additional devicecomponents 1499 of the device 1410-4. In some examples, this DC signalhas a voltage of 5 V at approximately a current of 1 amp. In general,know that appropriate selection of the components of the rectifier 1910,the filtering/rectifying capacitor, Crect, and a voltage regulator 1920may be made to generate a DC signal having an appropriate and desiredvoltage and current rating.

The variation of the rectified DC voltage, V_rect, is shown at thebottom right of the diagram as a function of time. As can be seen, thefiltering/rectifying capacitor, Crect, is operative to charge anddischarge thereby maintaining a DC level within a certain range having acertain level during the charge or discharge of the filtering/rectifyingcapacitor, Crect. The voltage regulator 1920 is operative to maintainthis output DC voltage even further thereby providing substantiallyconstant DC level.

FIG. 20 is a schematic block diagram of another embodiment 2000 ofvarious devices including a device 1409-3 that is operative to transferpower and communicate wirelessly in accordance with the presentinvention. This diagram is similar to the previous diagram with at leastsome difference being that one or more processing modules 42 a areincluded within the device that includes the second coil within device1410-5. The one or more processing modules 42 a are shown as being incommunication with the lines coming from the two terminals of the secondcoil within the device 1410-5 via the two transistors, such as N-typeMOSFET transistors, and AC coupling capacitors. The one or moreprocessing modules 42 a is operative to facilitate communication to thedevice 1409-3 that includes the first coil via the second coil and viathe transistors and AC coupling capacitors.

The one or more processing modules 42 a is operative to facilitatebidirectional communication with the one or more processing modules 42via the coupling and connectivity between the respective devices thatinclude the first coil and the second coil, respectively. In an exampleof operation and implementation, the one or more processing modules 42 ais operative to provide a communication signal that is detected by a DSCthat includes the first coil, such as DSC 28-19. Such a communicationsignal provided from the one or more processing modules 42 a may includea number of different types of information. Some examples, such acommunication signal includes information that indicates the presence ofthe device 1410-5 that includes the second coil and that is suitable forreceiving power wirelessly from the device includes a first coil. Inother examples, such a communication signal includes information that isused by the device that includes the first coil in accordance withadjustment of one or more parameters of the drive signal. When evenother examples, such communication signal includes information regardingstatus of the battery within a device 1410-5 that includes the secondcoil. Based on status of the battery within the device 1410-5 thatincludes the second coil being of a charged status, the informationwithin the communication signal may be used by the device that includesthe first coil to stop providing the drive signal. This may beeffectuated by the one or more processing modules 42 operating to adjustand amplitude of the reference signal to zero to stop the DSC associatedtherewith (e.g., DSC 28-19 in this diagram) from providing the drivesignal to the first coil via the single-line and via the resonatingcapacitor 1402.

Generally speaking, any type of communication may be facilitated betweenthe one or more processing modules 42 associated with the first device1409-3 that includes the first coil and the one or more processingmodules 42 a associated with the second device 1410-5 that includes thesecond coil.

In addition, in certain examples, one or more sensors of one or moretypes may be included within the first device 1409-3 that includes thefirst coil and/or the second device 1410-5 that includes the secondcoil. For example, one or more sensors 2010 are implemented within thefirst device 1409-3 that includes the first coil, and/or one or moresensors 2011 are implemented within the second device 1410-5 thatincludes a second coil. These one or more sensors 2010 and 2011 are incommunication with the respective one or more processing modules 42/42 ain the respective devices 1409-3 and 1410-5 that include the first andsecond coils, respectively. Communication between with the one or moreprocessing modules 42/42 a and the one or more sensors 2010 and 2011 maybe facilitated via one or more DSCs 28. In some examples, a separaterespective DSC 28 is implemented to facilitate communication between theone or more processing modules 42/42 a and each respective one of theone or more sensors 2010/2011.

Examples of such sensors 2010 and/or 2011 may include any of a number oftypes of sensors such as temperature sensors, voltage sensors, impedancesensors (e.g., such as to determine impedance of a battery and/or othercomponents of the device 1410-5 and includes the second coil. Forexample, a temperature sensor 2010 is implemented in sufficientproximity to the first coil as to detect temperature of another device,such as device 1410-5, when that other device is present and within asufficient proximity as to facilitate electromagnetic (inductive)coupling between the first coil in the first device 1409-3 and thesecond coil in the second device 1410-5. In addition, such a temperaturesensor 2010 is implemented to monitor temperature during operation ofthe first device 1409-3 and the second device 1410-5 including wirelesspower transfer from the first device 1409-3 to the second device 1410-5.The one or more processing modules 42/42 a is operative to useinformation provided by the one of the one or more sensors 2010/2011 toadapt operation of any one or more components within the first device1409-3/second device 1410-5.

FIG. 21 is a schematic block diagram of another embodiment 2100 ofvarious devices including a device 1409-3 that is operative to transferpower and communicate wirelessly in accordance with the presentinvention. This diagram has some similarities to the previous diagramwith at least some difference being a device 1410-6 that includes theone or more processing modules 42 a is in communication with one of theterminals of the second coil via a DSC 28 and via an AC couplingcapacitor. The other terminal of the second coil is coupled to groundvia an AC coupling capacitor as well. This implementation facilitatescommunication between the devices 1409-3 and 1410-6 via another DSC 28that is implemented within the device 1410-6. Note that the one or moreprocessing modules 42 a of the device 1410-6 mini implemented controlany of the various parameters associated with the reference signalassociated with the DSC 28 that is in communication with one of theterminals of the second coil via an AC coupling capacitor.

FIG. 22 is a schematic block diagram of another embodiment 2200 ofvarious devices including a device 1409-3 that is operative to transferpower and communicate wirelessly in accordance with the presentinvention. This diagram has some similarities to the previous diagramwith at least some difference being a device 1410-7 that includes theone or more processing modules 42 a is in communication with both of theterminals of the second coil via respective DSCs 28 and via respectiveAC coupling capacitors. This implementation facilitates communicationbetween the devices 1409-3 and 1410-7 via two additional DSCs 28 thatare implemented within the device 1410-7. Note that the one or moreprocessing modules 42 a of the device 1410-6 mini implemented controlany of the various parameters associated with the reference signalsassociated with these two additional DSCs 28 that are s in communicationwith the respective terminals of the second coil via respective ACcoupling capacitors.

Certain of the following diagrams provide illustration of change ofcertain parameters of a battery during charging and/or dischargingoperations. Note that such illustrations are examples of some possibletrends during such operations. For a particular battery of a certaintype, construction, composition, etc., such trends may be made based onactual monitoring and tracking of that particular battery duringacceptable or normal operation, from information provided from amanufacturer of that particular battery, from information associatedwith similar types of batteries, and/or other information. For example,considering a new battery, such trends and profiles may be madespecifically for that battery during its initial operation to establisha baseline or acceptable range within which the battery is expected tooperate. Detection of deviation from that baseline or acceptable rangemay be used as a basis to identify a problem in charging and/ordischarging operations.

In addition, such trends and profiles may be used as a basis or bases todetermine whether or not a component within proximity to a device thatis operative to transfer power and communicate wirelessly is in fact adevice that is suitable for receiving power and/or communicationwirelessly. For example, based on monitoring and tracking of one or moreelectrical characteristics of a drive signal provided to the first coilwithin such a device that is operative to transfer power and communicatewirelessly, one or more processing modules is operative to make adetermination whether or not there is a presence of an actual componentthat is in fact a device that is suitable for receiving power and/orcommunication wirelessly. Consider a situation in which the one or moreelectrical characteristics of the drive signal provided to the firstcoil are not contained within an acceptable range that is expected whentransferring power and/or communicating wirelessly (e.g., such as for adevice that is suitable for receiving power and/or communicationwirelessly), then the one or more processing modules is operative tomake a determination that there is no device that is suitable forreceiving power and/or communication wirelessly present. In someexamples when such a determination is made, the one or more processingmodules operative to execute one or more operations which may includestopping of the charging process (e.g., by adjusting and amplitude ofthe reference signal to zero to stop the DSC from providing a drivesignal in accordance with a charging operation), or other operations.

Various diagrams, embodiments, examples, etc. of a device (e.g., any ofdevices 1409-1, 1409-1, 1409-2, 1409-3) that is operative to providepower and/or communicate wirelessly in accordance with the manner asdescribed herein may be configured to perform various functions andoperations. For example, such a device that includes a DSC, memory thatstores operational instructions, and one or more processing modulesoperably coupled to the DSC and the memory (or alternatively, the one ormore processing modules includes the memory) may be configured toperform various functions and operations.

In an example of operation and implementation, the one or moreprocessing modules is configured to process the digital signalrepresentative of the one or more electrical characteristics of thedrive signal to determine whether a signal associated with the anotherdevice is coupled into the drive signal thereby indicating presence ofthe another device within the proximity to the device that facilitateselectromagnetic coupling between the first coil and the second coil.Based on determination that no signal associated with the another deviceis coupled into the drive signal, the one or more processing modules isconfigured to adjust an amplitude of the reference signal to zero tostop the DSC from providing the drive signal to the first coil via thesingle line and via the resonating capacitor.

In another example of operation and implementation, the one or moreprocessing modules is configured to process the digital signalrepresentative of the one or more electrical characteristics of thedrive signal to determine a current profile of the current flowingthrough the first coil. The one or more processing modules is alsoconfigured to determine whether the current profile of the currentflowing through the first coil compares favorably with one or morepredetermined current profiles associated with wireless power transferfrom the device to the another device in accordance with charging of abattery of the another device. Based on determination that the currentprofile of the current flowing through the first coil comparesunfavorably with one or more predetermined current profiles associatedwith charging of the battery of the another device, the one or moreprocessing modules is configured to adjust an amplitude of the referencesignal to zero to stop the DSC from providing the drive signal to thefirst coil via the single line and via the resonating capacitor.

In yet another example of operation and implementation, the one or moreprocessing modules is configured to process the digital signalrepresentative of the one or more electrical characteristics of thedrive signal to determine an impedance profile of the another deviceassociated with the second coil. The one or more processing modules isalso configured to determine whether the impedance profile of theanother device associated with the second coil compares favorably with abattery impedance profile associated with charging of a battery of theanother device. Based on determination that the impedance profile of theanother device associated with the second coil compares unfavorably witha battery impedance profile associated with charging of the battery ofthe another device, the one or more processing modules is configured toadjust an amplitude of the reference signal to zero to stop the DSC fromproviding the drive signal to the first coil via the single line and viathe resonating capacitor.

In an example of operation and implementation, the one or moreprocessing modules is configured to execute the operational instructionsto generate the reference signal as a sinusoidal signal. In otherexamples, the one or more processing modules is configured to executethe operational instructions to adapt an amplitude of the referencesignal based on the one or more electrical characteristics of the drivesignal to maximize the error signal (e.g., maximize Ve). In additionalexamples, the one or more processing modules is configured to generatethe reference signal to have a frequency that is based on a resonantfrequency associated with an inductance of the first coil and acapacitance of the resonating capacitor.

As shown in various diagrams, certain examples of DSCs include acomparator configured to produce the error signal based on comparison ofthe reference signal to the drive signal, wherein the reference signalis received at a first input of the comparator, and the drive signal isreceived at a second input of the comparator. Such examples of DSCs alsoinclude a dependent current supply configured to generate the drivesignal based on the error signal and to provide the drive signal via thesingle line that couples to the resonating capacitor and the secondinput of the comparator and an analog to digital converter (ADC)configured to process the error signal to generate the digital signalrepresentative of the one or more electrical characteristics of thedrive signal. In certain examples, note also that the one or moreprocessing modules is configured to execute the operational instructionsto adjust a programmable gain of the dependent current supply. Note thatscaling the programmable gain of the dependent current supply providesfor scaling of the error signal.

Note that any type of device operative to receive power and/orcommunication wirelessly may benefit from and operate in conjunctionwith a device that is operative to provide power and/or communicationwirelessly as described herein. Examples of such a device operative toreceive power and/or communication wirelessly may include any one ormore of a laptop computer, a cell phone, an electronic pad device, apersonal digital assistant, a portable music devices, a portable mediaplayers, a tablet, a digital camera, and/or any other type of device.

FIG. 23 is a schematic block diagram of an embodiment 2300 of a batteryimpedance profile such as associated with a battery of a device duringbattery charging in accordance with wireless transfer of power inaccordance with the present invention. At the top of the diagram is abasic equivalent circuit associated with a battery. The battery may bemodeled to have a voltage source corresponding to an open circuitvoltage, Voc, of the battery, an internal resistance, Rint, and a loadresistance, Rload (e.g., when the battery is connected to such a load).More complex equivalent circuit models of batteries also exist thatcharacterize internal impedance of the battery as being complex innature, having not only resistive but capacitive and/or inductivecomponents as well. While this particular example is provided as do thewith resistive impedances of an internal resistance, Rint, and a loadresistance, Rload, note that an appropriately implemented DSC 28 isfully operative to detect impedance including change of impedance in acomponent connected thereto being resistive or complex in nature.

As the internal resistance, Rint, of the battery increases, a voltagedrop across that internal resistance, Rint, namely, Vint, will increaseas well as the battery is attempting to deliver a current, I, to theload resistance, Rload. In accordance with a battery charging process,the internal resistance, Rint, of the battery can change. For example,during a charging operation, there is typically an associated trend ofincreasing internal resistance, Rint, of the battery during the chargingprocess. Conversely, during a discharging operation, there is typicallyan associated trend of decreasing internal resistance, Rint, of thebattery during the discharging process.

An appropriately implemented DSC 28 is operative to detect impedanceincluding change of impedance in a component connected thereto. Forexample, an appropriately implemented DSC 28 in communication with abattery is operative to detect the impedance of the battery includingchange impedance of the battery. Appropriate monitoring of a batteryusing such a DSC 28 during charging and/or discharging operationsfacilitates monitoring and tracking of the changing impedance of thebattery over time.

Similarly, an appropriately implemented DSC 28 is operative to detectchange of current that is drawn by or concerned by a component connectedthereto. For example, an appropriately implemented DSC 28 incommunication with a battery is operative to detect the current drawn byor consumed by the battery including change thereof during a chargingoperation and/or the current delivered by the battery including changethereof during a discharging operation. Considering various embodiments,examples, etc. as included herein, a DSC 28 that is providing a drivesignal via a resonating capacitor 1402 the first coil is also operativeto detect the impedance of those one or more components to which thedrive signal is being provided including change thereof.

In some examples, the change of impedance of the battery is within aparticular range (e.g., changing within a range between a minimum andmaximum of internal resistance, Rint(min) and Rint(max)) during thecharging and/or discharging operations.

Generally speaking, a profile of change of impedance of the batteryduring charging and/or discharging operations can be used for comparisonto ensure whether or not the battery is operating within acceptableranges. For example, a profile of change of impedance of the batteryduring charging and/or discharging operations may be generated based onmonitoring the battery during normal and acceptable charging and/ordischarging operations, based on information provided from batterymanufacturer specifications, based on information known of batteries ofsimilar type, construction, etc. and/or other means.

In an example of operation and implementation, one or more processingmodules is operative to process information provided from anappropriately implemented DSC to monitor whether or not a chargingand/or discharging operation is operating in an acceptable manner. Forexample, based on detection of impedance of that component being outsideof an acceptable range of change of impedance of the battery during acharging operation, the one or more processing modules is operative tomake a determination that there is an error or problem with the chargingoperation. The one or more processing modules operative to execute oneor more operations which may include stopping of the charging process(e.g., by adjusting and amplitude of the reference signal to zero tostop the DSC from providing a drive signal in accordance with a chargingoperation), modifying a reference signal thereby modifying the drivesignal (e.g., adjusting one or more parameters of the reference signal),or other operations.

In another example, the one or more processing modules is operative todetect the presence or lack of presence of a device that is suitable forreceiving power wirelessly. For example, based on detection of change ofimpedance of a component being outside of an acceptable range of changeof impedance of the battery, the one or more processing modules isoperative to make a determination that the component is not a devicethat is suitable for receiving power wirelessly. Consider an example inwhich a component that is not appropriate for reception of powerwirelessly (e.g., perhaps the component is not a device at all that is acandidate for receiving power wirelessly), then based on detection ofchange of impedance of such a component being outside of an acceptablerange of change of impedance of the battery, the one or more processingmodules is operative to make a determination that the component is not adevice that is suitable for receiving power wirelessly and execute oneor more operations.

FIG. 24 is a schematic block diagram of an embodiment 2400 of a batterytemperature profile such as associated with a battery of a device duringbattery charging in accordance with wireless transfer of power inaccordance with the present invention. This diagram shows generallyvarious profiles of changing temperature of the battery over time duringcharging operations. Again, for a particular battery of a certain type,construction, composition, etc., such trends may be made based on actualmonitoring and tracking of that particular battery during acceptable ornormal operation, from information provided from a manufacturer of thatparticular battery, from information associated with similar types ofbatteries, and/or other information.

In this diagram, consider an example of a Lithium-ion battery having aneffective operational range between 10-40° C. or 50-104° F., and furtherconsider an acceptable range or change of temperature, such as X° C. orF, where X is some determine the value by which the temperature of thebattery changes during charging operations in accordance with acceptableor normal operation. When temperature is monitored as being within suchan acceptable range or change of temperature during a charging process,then one or more processing modules is operative to facilitatecontinuation of the charging process. However, when temperature ismonitored as being outside of such an acceptable range or change oftemperature during a charging process, then one or more processingmodules is operative to execute one or more operations which may includestopping of the charging process.

Consider an example of a device that is operative to transfer power andcommunicate wirelessly including a temperature sensor in proximity ofthe first coil thereof, then monitoring temperature at that location maybe a basis to determine whether or not a component in proximity theretois an actual device that is suitable for receiving power and/orcommunication wirelessly, whether or not operation of charging of abattery of a device that is suitable for receiving power and/orcommunication wirelessly is operating within a normal or acceptablerange, etc.

In an example of operation and implementation, one or more processingmodules is operative to process information provided from anappropriately implemented DSC to monitor whether or not a chargingand/or discharging operation is operating in an acceptable manner. Forexample, based on detection of temperature of that component beingoutside of an acceptable range of change of temperature of the batteryduring a charging operation, the one or more processing modules isoperative to make a determination that there is an error or problem withthe charging operation. The one or more processing modules operative toexecute one or more operations which may include stopping of thecharging process (e.g., by adjusting and amplitude of the referencesignal to zero to stop the DSC from providing a drive signal inaccordance with a charging operation), modifying a reference signalthereby modifying the drive signal (e.g., adjusting one or moreparameters of the reference signal), or other operations.

In another example, the one or more processing modules is operative todetect the presence or lack of presence of a device that is suitable forreceiving power wirelessly. For example, based on detection of change oftemperature of a component being outside of an acceptable range ofchange of temperature of the battery, the one or more processing modulesis operative to make a determination that the component is not a devicethat is suitable for receiving power wirelessly. Consider an example inwhich a component that is not appropriate for reception of powerwirelessly (e.g., perhaps the component is not a device at all that is acandidate for receiving power wirelessly), then based on detection ofchange of temperature of such a component being outside of an acceptablerange of change of temperature of the battery, the one or moreprocessing modules is operative to make a determination that thecomponent is not a device that is suitable for receiving powerwirelessly and execute one or more operations.

FIG. 25 is a schematic block diagram of another embodiment 2500 ofvarious devices including a device that is operative to transfer powerand communicate wirelessly in accordance with the present invention.This diagram has some similarities to certain of the prior diagrams willwith at least some differences being that DSC 28-25 includes a poweramplifier 2510 that is implemented in conjunction with the voltagedivider 2522 replace the dependent current source included in certain ofthe other diagrams. In some embodiments, note that the one or moreprocessing modules 42 is implemented to direct operation of one or bothof the power amplifier 2510 and the voltage divider 2520. For example,the one or more processing modules 42 is operative to adjust the voltagedivision being performed by the voltage divider 2520 (e.g., by selectingdifferent respective impedances as may be included within a voltagedivider including multiple selective voltage division paths, adjustingone or more variable impedances that may be included within such avoltage divider, etc.).

In addition, note that the operation of the power amplifier 2510 may beadapted by the one or more processing modules 42 as well. For example,consider a gain factor as may be included within the power amplifier2510, such as if the power amplifier 2510 is incremented as aprogrammable amplifier (PGA), then the one or more processing modules 42is configured to adjust the programmability/gain factor of the poweramplifier 2510 as desired. Generally speaking, the one or moreprocessing modules 42 is operative to adjust operation, configuration,etc. of the power amplifier 2510 and/or voltage divider 2520 based onand in accordance with any of the means described herein by whichinformation is determined, received, etc. by the one or more processingmodules 42 (e.g., based on the sensing of the drive signal from the DSC28-17, based on communication from device 1410-3, etc.).

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provide an industry-accepted tolerance for its corresponding term and/orrelativity between items. For some industries, an industry-acceptedtolerance is less than one percent and, for other industries, theindustry-accepted tolerance is 10 percent or more. Other examples ofindustry-accepted tolerance range from less than one percent to fiftypercent. Industry-accepted tolerances correspond to, but are not limitedto, component values, integrated circuit process variations, temperaturevariations, rise and fall times, thermal noise, dimensions, signalingerrors, dropped packets, temperatures, pressures, material compositions,and/or performance metrics. Within an industry, tolerance variances ofaccepted tolerances may be more or less than a percentage level (e.g.,dimension tolerance of less than +/−1%). Some relativity between itemsmay range from a difference of less than a percentage level to a fewpercent. Other relativity between items may range from a difference of afew percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1. As maybe used herein, the term “compares unfavorably”, indicates that acomparison between two or more items, signals, etc., fails to providethe desired relationship.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, micro-controller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, and/or any device thatstores digital information. The memory device may be in a form asolid-state memory, a hard drive memory, cloud memory, thumb drive,server memory, computing device memory, and/or other physical medium forstoring digital information.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A device that is operative to transfer powerwirelessly, the device comprising: a drive-sense circuit (DSC) operablycoupled to receive a reference signal and to generate a drive signalbased on the reference signal, wherein, when enabled, the DSC operablycoupled and configured to: provide the drive signal to a first coil viaa single line and via a resonating capacitor and simultaneously to sensethe drive signal via the single line, wherein the first coil isimplemented to transfer power wirelessly to a second coil of anotherdevice, wherein sensing of the drive signal via the single line includesdetection of one or more electrical characteristics of the drive signal;and generate a digital signal representative of the one or moreelectrical characteristics of the drive signal based on an error signalcorresponding to a difference between the drive signal and the referencesignal; memory that stores operational instructions; and one or moreprocessing modules operably coupled to the DSC and the memory, wherein,when enabled, the one or more processing modules is configured toexecute the operational instructions to: generate the reference signal;process the digital signal to determine the one or more electricalcharacteristics of the drive signal; determine whether the anotherdevice is within proximity to the device and is suitable for receivingpower wirelessly from the device based on the one or more electricalcharacteristics of the drive signal; and based on a determination thatthe another device is present and is suitable for receiving powerwirelessly from the device, continue to provide the reference signal tothe DSC to facilitate wireless power transfer from the first coil to thesecond coil of the another device.
 2. The device of claim 1, wherein,when enabled, the one or more processing modules further configured toexecute the operational instructions to: based on another determinationthat the another device is at least one of not present or is notsuitable for receiving power wirelessly from the device, adjust anamplitude of the reference signal to zero to stop the DSC from providingthe drive signal to the first coil via the single line and via theresonating capacitor.
 3. The device of claim 1, wherein, when enabled,the one or more processing modules further configured to execute theoperational instructions to: monitor and track the one or moreelectrical characteristics of the drive signal provided to the firstcoil; and based on the monitoring and tracking the one or moreelectrical characteristics of the drive signal provided to the firstcoil, determine whether the another device is within proximity to thedevice and is suitable for receiving power wirelessly from the devicebased on the one or more electrical characteristics of the drive signal;and based on another determination that the another device is presentand is suitable for receiving power wirelessly from the device based onthe monitoring and tracking the one or more electrical characteristicsof the drive signal provided to the first coil, continue to provide thereference signal to the DSC to facilitate wireless power transfer fromthe first coil to the second coil of the another device.
 4. The deviceof claim 3, wherein, when enabled, the one or more processing modulesfurther configured to execute the operational instructions to: based onat least one other determination that the another device is at least oneof not present or is not suitable for receiving power wirelessly fromthe device based on the monitoring and tracking the one or moreelectrical characteristics of the drive signal provided to the firstcoil, adjust an amplitude of the reference signal to zero to stop theDSC from providing the drive signal to the first coil via the singleline and via the resonating capacitor.
 5. The device of claim 1, whereinthe first coil is located within a proximity to the second coil of theanother device that facilitates electromagnetic coupling between thefirst coil and the second coil, and the drive signal being provided tothe first coil is operative to transfer power wirelessly from the firstcoil to the second coil of the another device.
 6. The device of claim 1,wherein the one or more electrical characteristics of the drive signalincludes at least one of: an impedance of the another device associatedwith the second coil; a change of impedance of the another deviceassociated with the second coil; a range of change of the impedance ofthe another device associated with the second coil; an impedance profileof the another device associated with the second coil; a current flowingthrough the first coil; a change of current flowing through the firstcoil; or a current profile of the current flowing through the firstcoil.
 7. The device of claim 1, wherein, when enabled, the one or moreprocessing modules further configured to execute the operationalinstructions to: adapt at least one parameter of the reference signalbased on the one or more electrical characteristics of the drive signal,wherein the at least one parameter of the reference signal includes amagnitude, a frequency, a signal type, a waveform type, or a phase. 8.The device of claim 1, wherein, when enabled, the one or more processingmodules further configured to execute the operational instructions to:adapt an amplitude of the reference signal based on the one or moreelectrical characteristics of the drive signal to maximize the errorsignal.
 9. The device of claim 1, wherein, when enabled, the one or moreprocessing modules further configured to execute the operationalinstructions to: generate the reference signal to have a frequency thatis based on a resonant frequency associated with an inductance of thefirst coil and a capacitance of the resonating capacitor.
 10. The deviceof claim 1, wherein the DSC further comprises: a comparator configuredto produce the error signal based on comparison of the reference signalto the drive signal, wherein the reference signal is received at a firstinput of the comparator, and the drive signal is received at a secondinput of the comparator; a dependent current supply configured togenerate the drive signal based on the error signal and to provide thedrive signal via the single line that couples to the resonatingcapacitor and the second input of the comparator; and an analog todigital converter (ADC) configured to process the error signal togenerate the digital signal representative of the one or more electricalcharacteristics of the drive signal.
 11. The device of claim 6, wherein,when enabled, the one or more processing modules further configured toexecute the operational instructions to: adjust a programmable gain ofthe dependent current supply, wherein scaling the programmable gain ofthe dependent current supply provides for scaling of the error signal.12. The device of claim 1, wherein the another device includes a laptopcomputer, a cell phone, an electronic pad device, a personal digitalassistant, a portable music devices, a portable media players, a tablet,or a digital camera.
 13. A device that is operative to transfer powerwirelessly, the device comprising: a drive-sense circuit (DSC) operablycoupled to receive a reference signal and to generate a drive signalbased on the reference signal, wherein, when enabled, the DSC operablycoupled and configured to: provide the drive signal to a first coil viaa single line and via a resonating capacitor and simultaneously to sensethe drive signal via the single line, wherein the first coil isimplemented to transfer power wirelessly to a second coil of anotherdevice, wherein sensing of the drive signal via the single line includesdetection of one or more electrical characteristics of the drive signal;and generate a digital signal representative of the one or moreelectrical characteristics of the drive signal based on an error signalcorresponding to a difference between the drive signal and the referencesignal; memory that stores operational instructions; and one or moreprocessing modules operably coupled to the DSC and the memory, wherein,when enabled, the one or more processing modules is configured toexecute the operational instructions to: generate the reference signal;process the digital signal to determine the one or more electricalcharacteristics of the drive signal; determine whether the anotherdevice is within proximity to the device and is suitable for receivingpower wirelessly from the device based on the one or more electricalcharacteristics of the drive signal; and based on a determination thatthe another device is at least one of not present or is not suitable forreceiving power wirelessly from the device, adjust an amplitude of thereference signal to zero to stop the DSC from providing the drive signalto the first coil via the single line and via the resonating capacitor.14. The device of claim 13, wherein, when enabled, the one or moreprocessing modules further configured to execute the operationalinstructions to: based on another determination that the another deviceis present and is suitable for receiving power wirelessly from thedevice, continue to provide the reference signal to the DSC tofacilitate wireless power transfer from the first coil to the secondcoil of the another device.
 15. The device of claim 13, wherein thefirst coil is located within a proximity to the second coil of theanother device that facilitates electromagnetic coupling between thefirst coil and the second coil, and the drive signal being provided tothe first coil is operative to transfer power wirelessly from the firstcoil to the second coil of the another device.
 16. The device of claim13, wherein the one or more electrical characteristics of the drivesignal includes at least one of: an impedance of the another deviceassociated with the second coil; a change of impedance of the anotherdevice associated with the second coil; a range of change of theimpedance of the another device associated with the second coil; animpedance profile of the another device associated with the second coil;a current flowing through the first coil; a change of current flowingthrough the first coil; or a current profile of the current flowingthrough the first coil.
 17. The device of claim 13, wherein, whenenabled, the one or more processing modules further configured toexecute the operational instructions to: generate the reference signalto have a frequency that is based on a resonant frequency associatedwith an inductance of the first coil and a capacitance of the resonatingcapacitor.
 18. The device of claim 13, wherein the DSC furthercomprises: a comparator configured to produce the error signal based oncomparison of the reference signal to the drive signal, wherein thereference signal is received at a first input of the comparator, and thedrive signal is received at a second input of the comparator; adependent current supply configured to generate the drive signal basedon the error signal and to provide the drive signal via the single linethat couples to the resonating capacitor and the second input of thecomparator; and an analog to digital converter (ADC) configured toprocess the error signal to generate the digital signal representativeof the one or more electrical characteristics of the drive signal. 19.The device of claim 18, wherein, when enabled, the one or moreprocessing modules further configured to execute the operationalinstructions to: adjust a programmable gain of the dependent currentsupply, wherein scaling the programmable gain of the dependent currentsupply provides for scaling of the error signal.
 20. The device of claim13, wherein the another device includes a laptop computer, a cell phone,an electronic pad device, a personal digital assistant, a portable musicdevices, a portable media players, a tablet, or a digital camera.